LCD Sealant Cutting via Absorbent Layer
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Solution Overview
Problem
The existing methods for fabricating liquid crystal display (LCD) devices face challenges in minimizing bezel size and enhancing reliability due to the limitations of the scribe-on-seal method, which requires high-energy laser beams for cutting, potentially damaging the sealant and the circumference of the cutting plane, leading to reduced reliability.
Innovation Solution
A method involving the formation of an absorbent layer on the sealant, which is burned using a low-energy laser beam before cutting, allowing the absorbent layer to absorb the laser energy and minimize direct exposure to the sealant, thereby reducing heat damage and enhancing the reliability of the LCD device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a high-energy laser beam is used to burn the sealant for cutting, then the cutting can be performed, but the sealant and the circumference of the cutting plane are damaged due to heat generation
Solution Approach 1:
A black matrix layer is introduced as an intermediary element between the laser beam and the sealant. This black matrix layer absorbs the laser energy and converts it to heat, which is then used to burn the sealant for cutting. By placing the black matrix layer first, it acts as a mediator that enables the cutting process while protecting the sealant from direct high-energy laser exposure, thus resolving the contradiction between ease of cutting and sealant reliability
Solution Approach 2:
The black matrix layer is formed on the sealant before the laser burning process. This preliminary formation of the black matrix layer prepares the surface to absorb laser energy efficiently, enabling the subsequent cutting process to proceed with lower energy levels that do not damage the sealant or the cutting plane circumference
2Strength
If the sealant is hardened using high-energy UV light, then the sealant achieves sufficient strength, but the bezel area cannot be minimized due to the need for wider margins
Solution Approach 1:
The black matrix layer is applied selectively to specific regions of the sealant where laser burning is needed for cutting, rather than covering the entire sealant surface. This localized application allows the sealant to maintain its full strength in areas where it is needed while enabling precise cutting in specific locations, thereby minimizing the bezel area without compromising overall sealant integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of a narrow bezel panel while maintaining the reliability of the LCD device by minimizing sealant damage and heat-induced issues, allowing for more precise cutting and improved adhesive strength.
Implementation Method 1
burned by a laser
Implementation Method 2
the absorbent layer to absorb the laser energy
Implementation Method 3
curing the sealant partially covered with the absorbent layer by irradiating UV light
Implementation Method 4
burned by a laser
Implementation Method 5
burning the absorbent layer using a laser beam
Data Source
AI summary
A method of fabricating an LCD device is discussed. The method according to an embodiment includes combining a first substrate having thin film transistors with a second substrate having black matrices and color filters using a sealant. Also, the method includes: forming an absorbent layer which is positioned to overlap with an edge of the sealant and burned by a laser; curing the sealant partially covered with the absorbent layer by irradiating UV light; burning the absorbent layer using a laser beam; and cutting the sealant through the burnt absorbent layer and the second substrate opposite to the absorbent layer using a scriber.