LCD Shielding Plate for Bezel-less FPC Concealment
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Solution Overview
Problem
Current bezel-less liquid crystal display (LCD) devices struggle to hide flexible printed circuit (FPC) boards, requiring wider bezels to maintain the aesthetic appeal, which compromises the bezel-less design.
Innovation Solution
A shielding plate with encapsulation adhesive is used to cover the edges of the LCD panel, integrating a reinforced glass plate and shielding layer, and a manufacturing method involving a shielding plate placement, encapsulation adhesive filling, curing, and cutting to secure the shielding plate without additional bezels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If FPC board is installed along the bezel and bent behind the display device, then the FPC board can be concealed, but the bezel width must be increased which compromises the bezel-less design
Solution Approach 1:
The harmful effect (FPC board visibility) is extracted and isolated by extending the array substrate's bonding section beyond the color filter substrate, creating a dedicated bonding area that allows FPC board attachment without requiring additional bezel width. The bonding section acts as a separate functional zone that resolves the conflict between concealing the FPC and maintaining narrow bezels.
Solution Approach 2:
The solution transitions from a two-dimensional planar arrangement (FPC board along the bezel edge) to a three-dimensional configuration where the bonding section extends in the depth direction beyond the color filter substrate. This dimensional extension allows the FPC board to be bonded to the rear surface of the bonding section, effectively hiding it from the front view while maintaining a narrow bezel profile.
2Object-affected harmful factors
If shielding plate is provided along LCD panel periphery to cover black edges, then shielding effect is improved, but device complexity increases
Solution Approach 1:
The shielding function is merged with the existing array substrate by extending its bonding section to serve dual purposes: providing a bonding area for the FPC board and acting as a shielding plate to cover the black edges. This integration eliminates the need for a separate shielding component, reducing device complexity while maintaining effective shielding.
Solution Approach 2:
The bonding section of the array substrate is designed to perform multiple functions simultaneously: it serves as an extended bonding area for FPC attachment, acts as a shielding plate to cover black edges, and provides structural support. This multi-functionality reduces the overall component count and simplifies the device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a bezel-less design with superior shielding, smooth edges, and enhanced encapsulation efficiency, ensuring the FPC board is hidden without additional bezels, while maintaining a lower-cost and efficient manufacturing process.
Implementation Method 1
the encapsulation adhesive is cured by applying ultraviolet light to the encapsulation adhesive
Data Source
AI summary
The present invention teaches a LCD device and a related manufacturing method. The LCD device includes a LCD panel and a shielding plate. The LCD panel includes an array substrate and a color filter substrate. The array substrate includes a display section attaching to the color filter substrate, and a bonding section extending from the display section and reaching beyond the color filter substrate. The shielding plate includes a first section above the color filter substrate, and a second section extending from the first section and corresponding to the bonding section. Encapsulation adhesive is filled between the second section and the bonding section. With shielding plate along a LCD panel's periphery to cover black edges of the LCD device, the LCD panel is guaranteed to have smooth edges and no additional bezel is required to hide the FPC board, fulfilling the bezel-less design.