Liquid Crystal Display Panel Side Bond Pad Narrow Frame Design
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Solution Overview
Problem
Current liquid crystal display panels in VA and TN modes face challenges in narrowing frame widths due to the staggered center positions of transfer pads and gold balls, which occupy excessive external space and lead to short circuits, making it difficult to achieve narrow frames.
Innovation Solution
A liquid crystal display panel design that includes a side bond pad on the substrates and sealing bezel adhesive layer, allowing direct electrical connection of the common voltage signal from a chip on film to the first common electrode, eliminating the need for gold balls and reducing external space, while maintaining signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If transfer pads and gold balls are used to transmit common voltage signals, then electrical connection is achieved, but external space is excessively occupied and frame narrowing is prevented
Solution Approach 1:
The patent extracts and eliminates the gold ball component from the signal transmission path. Instead of using traditional gold ball bump connections between the common electrode and external circuits, the invention uses a printed conductive material that directly integrates the common voltage signal line into the substrate, removing the need for separate gold ball components and reducing external space occupation.
Solution Approach 2:
The patent merges the common electrode and common voltage signal line into a single integrated structure. The common electrode itself serves as the signal line, eliminating the need for separate transfer pads and gold balls. This consolidation reduces the number of discrete components and minimizes the external space required for signal transmission.
2Ease of manufacture
If transfer pads and gold balls are staggered during manufacturing, then alignment flexibility is provided, but occupied external space increases
Solution Approach 1:
By removing the gold ball component entirely, the patent eliminates the need for staggered alignment between transfer pads and gold balls. The printed conductive material can be directly aligned with the common electrode without requiring offset positioning, simplifying the manufacturing alignment process while reducing external space.
3Reliability
If gold ball processes are used, then electrical connection is established, but production complexity and time increase
Solution Approach 1:
The patent replaces the mechanical gold ball bump connection process with a printed conductive material approach. Instead of using automated pick-and-place machines to position and attach gold balls, the invention uses printing technology to directly deposit conductive material onto the substrate, significantly simplifying the manufacturing process and improving production efficiency while maintaining reliable electrical connection.
4Ease of operation
If conventional common voltage signal transmission through TFT array substrate is used, then signal routing is achieved, but external space and manufacturing complexity increase
Solution Approach 1:
The patent combines the common electrode and common voltage signal line into one integrated component. The common electrode directly serves as the signal transmission path, eliminating the need for separate signal lines through the TFT array substrate. This integration reduces manufacturing complexity while maintaining full signal transmission capability.
Data Source
AI summary
The present disclosure provides a liquid crystal display panel and a manufacturing method thereof by disposing a side bond pad on sides of a first substrate and a second substrate, and a side of a sealing bezel adhesive layer away from a liquid crystal layer. Wherein, the side bond pad is in contact with a first transparent conductive layer of the first substrate, and a chip on film is bonded to the side bond pad in a side bonding way. It can achieve that a common voltage signal is transmitted from a side of the first substrate to the first substrate, processes relating to gold ball are reduced, and an external space of a panel is effectively narrowed.