LCD Device Heat Dissipation via Staggered Frame Vents
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Solution Overview
Problem
Conventional LCD devices face inefficiencies in heat dissipation, leading to damage to liquid crystals and display failures due to heat being conducted to the LCD panel, with existing solutions offering non-ideal heat dissipation efficiency through conduction and air convection.
Innovation Solution
The LCD device incorporates through holes in the middle and front frames to directly dissipate heat from the cavity to the outside, accompanied by a baffle to prevent light leakage, enhancing heat dissipation efficiency through air convection and simplifying the design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If heat dissipation is achieved through heat conduction and air convection in sequence, then heat can be dissipated from the light source, but the heat dissipation efficiency is low and the heat dissipation effect is non-ideal
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional sequential conduction-convection path and creates a dedicated air convection channel through air vents. The air vents are thermally connected to the LED light source and extend to the external environment, allowing heat to be directly carried away by air flow without relying on sequential heat conduction through multiple components, thereby significantly improving heat dissipation efficiency and protecting display reliability.
2Loss of energy
If the middle frame and front frame are provided with through holes for direct heat dissipation, then heat dissipation efficiency is improved, but light leakage may occur
Solution Approach 1:
The patent segments the through hole into two separate components: a middle frame through hole and a front frame through hole. These two holes are staggered rather than aligned, creating a stepped configuration that allows heat to dissipate through both openings while the misalignment prevents direct light paths from the light source to the external environment, thus solving both heat dissipation and light leakage requirements simultaneously.
3Illumination intensity
If the middle frame through hole is staggered with the front frame through hole to prevent light leakage, then light leakage is reduced, but the heat dissipation path may be obstructed
Solution Approach 1:
The patent resolves the conflict between light leakage prevention and heat dissipation by transitioning from a one-dimensional alignment problem to a two-dimensional spatial arrangement. The middle frame through hole and front frame through hole are positioned at different locations and orientations, creating a three-dimensional staggered configuration. This dimensional change allows heat to escape through multiple pathways while blocking direct light transmission, as the staggered positions prevent collinear light paths while maintaining thermal connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides a more direct, efficient, and cost-effective heat dissipation method, reducing the risk of liquid crystal damage and improving display reliability by utilizing air convection for heat dissipation.
Implementation Method 1
heat is conducted outside through the air convection of the air vents
Implementation Method 2
the heat generated by the light source assembly 400 is conducted to the middle frame 200 via the closed space A and then to the LCD panel 600
Data Source
AI summary
The invention provides an LCD device, and the LCD device comprises a front frame, a middle frame, and a back frame in sequence from outside to inside. A light guide panel is arranged between the back frame and the middle frame. A cavity is formed by the middle frame, the back frame, and the light guide panel, and a light source assembly is arranged in the cavity. The middle frame is provided with a middle frame through hole communicated with the cavity, and the front frame is provided with a front frame through hole communicated with the middle frame through hole. Because the middle frame and the front frame of the invention are respectively provided with through holes, the heat accumulated in the cavity is directly dissipated to the outside through air convection. Compared with the heat dissipation mode of using conduction and air convection, the heat dissipation mode of the invention has the advantages of directness, simplicity, and convenience, thereby having preferable heat dissipation effect.


