LCD Substrate Image Input Hole Formation via Dummy Wire Thickness Measurement
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Solution Overview
Problem
The integration of a camera lens into a liquid crystal display (LCD) increases the overall thickness of the device, and existing methods for forming an image input hole in the LCD substrate can lead to defects and require additional manufacturing processes, making it challenging to precisely determine the hole's location and depth.
Innovation Solution
A method involving a dummy wire on the first substrate, where the wire is used to measure the substrate's thickness and guide the formation of an image input hole without damaging the second substrate, allowing for precise placement and depth determination of the hole using a laser beam and incising tool, thereby improving the defect rate and manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an image input hole is formed in the LCD substrate to integrate a camera lens, then the device functionality is improved, but the overall thickness of the device increases
Solution Approach 1:
The camera lens is integrated by forming an image input hole through the first substrate and positioning the lens within the display device structure, nesting the camera component within the existing LCD assembly to achieve multi-functionality while managing thickness
2Adaptability or versatility
If an image input hole is formed in the first substrate, then camera integration is enabled, but the second substrate may be damaged
Solution Approach 1:
The thickness of the first substrate is measured before forming the image input hole, allowing the drilling depth to be precisely controlled to stop before reaching the second substrate, thus preventing damage while enabling camera integration
Solution Approach 2:
A laser beam is used to measure the substrate thickness and guide the drilling process, replacing traditional mechanical measurement methods with optical measurement for higher precision and non-contact operation
3Ease of manufacture
If traditional methods are used to form an image input hole, then the hole can be created, but manufacturing defects increase and additional processes are required
Solution Approach 1:
A laser beam is used both to measure the substrate thickness and to guide the drilling process, replacing traditional mechanical measurement and positioning methods with optical fields for higher precision and reduced manufacturing defects
Solution Approach 2:
The laser beam measurement of substrate thickness provides feedback information that is used to control the drilling depth, creating a closed-loop process that ensures precise hole formation without damaging the second substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the precise formation of an image input hole in the LCD substrate, reducing manufacturing defects and shortening the production process while maintaining the integrity of the second substrate, thus enhancing the overall manufacturing efficiency and reducing waste.
Implementation Method 1
measuring a laser beam reflected from the dummy wire on the first substrate
Data Source
AI summary
A liquid crystal display includes a first substrate including: a display area including a plurality of pixels on the first substrate, a non-display area which is disposed on an outside of the display area and in which a dummy wire is disposed on the first substrate, and an image input hole which is defined therein in the non-display area and in which an image input device is disposed, a second substrate facing the first substrate and including a display area and a non-display area corresponding to those of the first substrate, a liquid crystal layer interposed between the first and second substrates, and a sealant which is in the non-display area of the first and second substrates and seals the liquid crystal layer between the first and second substrates. The dummy wire is disposed near the image input hole.


