LCD Substrate Inspection Pads Across Scribing Boundaries
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Solution Overview
Problem
The existing processes for producing liquid crystal display (LCD) panels involve a large number of steps, including scribing and grinding, which can lead to reduced yield and increased manufacturing costs, especially when fabricating smaller panels from larger substrates.
Innovation Solution
The proposed solution eliminates the need for a grinding step by designing an LCD substrate structure with inspection pads and signal lines that extend across scribing boundaries, allowing for the removal of these components during the cutting process, thus simplifying the manufacturing method and reducing the number of process steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the existing scribing and grinding process is used to produce LCD panels, then the panels can be separated from the substrate, but the number of process steps increases and manufacturing cost increases
Solution Approach 1:
The invention extracts and eliminates the grinding step from the traditional manufacturing process. By designing the signal lines to extend beyond the active area boundary, the inspection pads can be removed during the scribing process itself, making the separate grinding step unnecessary and simplifying the overall manufacturing process
Solution Approach 2:
The signal lines are preliminarily designed to extend beyond the active area boundary during the substrate fabrication stage. This preliminary design enables the inspection pads to be naturally removed during scribing, eliminating the need for subsequent grinding operations and reducing the total number of process steps
2Reliability
If the grinding process is used to remove inspection pads and signal lines, then the panels are ready for use, but yield decreases and manufacturing cost increases
Solution Approach 1:
The invention extracts the inspection pads and signal lines beyond the active area boundary, allowing them to be removed during the scribing process. This eliminates the separate grinding step that previously reduced yield and increased costs, while still achieving complete removal of non-functional elements
Solution Approach 2:
The invention merges the removal of inspection pads and signal lines with the scribing process itself. By extending signal lines beyond the active area, the scribing cut naturally removes these components along with the inactive area, combining multiple functions into a single process step and improving overall yield
Data Source
AI summary
An LCD substrate including multiple LCD panels may be cut along a scribing boundary. All or part of one or more test pads or test signal lines may extend in whole or in part across the scribing boundary. When the LCD substrate is cut along the scribing boundary, the test pads or test signal lines are cut or removed.