Liquid Crystal Display Substrate Cutting via Two-Step Laser Irradiation
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Solution Overview
Problem
The existing methods for manufacturing liquid crystal display devices using etching to cut substrates expose components to etching solutions, leading to component failure due to the exposure of liquid crystal and electronic circuits to the etching solution.
Innovation Solution
A method involving a two-step laser irradiation process with different energies followed by an etching step, where specific positions on the glass plates are not cleaved to prevent exposure of sensitive components, and a scribing method for cutting, ensuring that only the outer periphery of the substrates is etched, thereby minimizing component failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If etching is used to cut substrates in stacked configuration, then substrate cutting is achieved, but components are exposed to etching solution causing component failure
Solution Approach 1:
The patent applies local quality by differentiating the treatment of different regions on the substrate. The laser irradiation selectively modifies only the peripheral regions (first positions) that require etching, while leaving the central regions (second positions) containing components untouched. This localized approach allows etching to proceed on the periphery without exposing internal components to the etching solution, thus resolving the contradiction between manufacturing ease and component reliability
Solution Approach 2:
The patent segments the substrate into distinct zones: first positions (peripheral regions to be etched) and second positions (central regions containing components to be protected). By dividing the substrate into these functional segments and applying different laser irradiation energies to each, the process enables selective etching of only the necessary portions while preserving component integrity
2Productivity
If laser beam with high energy is used to cut substrates, then cutting efficiency is improved, but components may be damaged by excessive energy
Solution Approach 1:
The patent implements local quality by applying two distinct laser irradiation energies to different spatial locations. High energy (second irradiation energy) is concentrated on peripheral first positions where cutting is needed, while low energy (first irradiation energy) is applied to central second positions containing components. This spatial differentiation of energy levels achieves efficient cutting without damaging sensitive components
Solution Approach 2:
The patent utilizes parameter changes by varying the laser irradiation energy parameter across different regions. The second irradiation energy is set higher than the first irradiation energy, creating a gradient effect that enables effective cutting at the periphery while maintaining component safety in the center. This parameter variation resolves the contradiction between cutting efficiency and component protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses component failure by controlling the etching process to only the outer periphery of the substrates, ensuring the integrity of the liquid crystal display device components during manufacturing.
Implementation Method 1
irradiating first positions of a first glass plate and a second glass plate with a laser beam having first irradiation energy
Implementation Method 2
irradiating second positions of the first glass plate and the second glass plate with the laser beam having second irradiation energy higher than the first irradiation energy
Implementation Method 3
exposing the display panel to an etching solution after the first irradiation step and the second irradiation step, such that the first positions are not cleaved, the second positions are cleaved, and at least a part of an outer periphery of each of the first substrate and the second substrate is formed
Data Source
AI summary
A method for manufacturing a liquid crystal display device including a display panel provided with a first substrate, a second substrate, and liquid crystal, the method comprises: a first irradiation step of irradiating first positions of a first glass plate and a second glass plate with a laser beam having first irradiation energy; a second irradiation step of irradiating second positions of the first glass plate and the second glass plate with the laser beam having second irradiation energy higher than the first irradiation energy; and an etching step of exposing the display panel to an etching solution after the first irradiation step and the second irradiation step, such that the first positions are not cleaved, the second positions are cleaved, and at least a part of an outer periphery of each of the first substrate and the second substrate is formed.