Liquid Crystal Display Substrate Sealing Holes Adhesion
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Solution Overview
Problem
The adhesion strength between substrates in liquid crystal display devices is compromised due to the narrowing of the frame region, leading to potential overlap of alignment films with sealing material, which reduces the adhesion among the sealing material, the first substrate, and the second substrate, especially with polyimide-based alignment films having low adhesion.
Innovation Solution
The introduction of sealing holes on the substrates opposite to the driving circuit area, allowing direct contact between the substrate base material and the sealing material, thereby enhancing the adhesion strength and reducing the frame region's contribution to the outer display area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the frame region is narrowed to enlarge the display area, then the display area is enlarged, but the adhesion strength between substrates is compromised due to alignment film overlap with sealing material
Solution Approach 1:
The alignment film is selectively removed from the corner regions where it would overlap with the sealing material. This extraction of the problematic alignment film portion eliminates the source of adhesion weakness while preserving the alignment film in the main display area, thus resolving the contradiction between enlarged display area and maintained adhesion strength
Solution Approach 2:
The alignment film is selectively removed only from specific corner regions where sealing material contact occurs, while maintaining the alignment film in other areas. This local modification approach allows the display area to be maximized while preventing adhesion issues only where necessary, resolving the contradiction between display area enlargement and adhesion strength preservation
2Manufacturing precision
If the frame region is narrowed to increase fineness and image quality, then fineness and image quality are improved, but the alignment film may overlap the coating region of the sealing material
Solution Approach 1:
The alignment film is extracted from the corner regions where it would interfere with sealing material coating. This removal eliminates the harmful overlap effect while preserving the fine display quality achieved through frame region narrowing, thus resolving the contradiction between manufacturing precision and preventing harmful factors
3Stability of the object's composition
If polyimide-based alignment film is used to control liquid crystal alignment, then initial alignment of liquid crystal molecules is controlled, but adhesion among sealing material, first substrate, and second substrate is lowered due to low adhesion of polyimide material
Solution Approach 1:
The polyimide alignment film is removed from corner regions where it would compromise adhesion. This selective extraction eliminates the low-adhesion material from critical sealing areas while preserving it in the display area where it performs its alignment function, thus resolving the contradiction between maintaining liquid crystal alignment stability and improving substrate adhesion
Solution Approach 2:
The alignment film is selectively removed only from corner regions where sealing material is applied, while maintaining it in the display area. This local quality modification allows the polyimide film to maintain its alignment function where needed while eliminating its harmful low-adhesion effect in sealing regions, resolving the contradiction between alignment stability and adhesion strength
Data Source
AI summary
A display device includes a first substrate having a first insulation film, a first conductive layer and a second insulation film, a second substrate opposed to the first substrate, a rectangular display area formed with a plurality of pixels, a sealing material formed outside the rectangular display area and securing the first substrate to the second substrate, and a driving circuit disposed on the first substrate, the driving circuit outputting a signal to the first conductive layer, the first substrate has a sealing hole area passing through thin film layers formed over the surface of the first substrate at least in corners of the first substrate on a side opposite to a side where the driving circuit is disposed on the first substrate.


