LCD Packaging Tray With Rhombic Grooves To Reduce Stress Concentration
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Solution Overview
Problem
Conventional trays for packaging LCD assemblies face challenges in distributing stress evenly, leading to excessive stress concentration and potential damage during transportation, as evidenced by high maximum stress and strain values in existing designs.
Innovation Solution
A tray design featuring a bottom plate with rhombic grooves and discharge grooves arranged to distribute stress concentration, where the discharge grooves are shallower and interconnected to form a network structure, reducing stress concentration in the center and enhancing compression strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the bottom plate of the tray is designed with conventional groove structures (long rectangular grooves, small circular grooves, or small rectangular grooves), then the tray can provide some stress distribution, but the maximum stress and strain values remain excessively high, leading to potential damage to LCD assemblies during transportation
Solution Approach 1:
The bottom plate is segmented into multiple rhombic grooves arranged in specific patterns, dividing the stress distribution into multiple zones. This segmentation allows stress to be distributed across numerous smaller regions rather than concentrated in single large grooves, effectively reducing peak stress values while maintaining overall structural strength
Solution Approach 2:
The patent employs asymmetric groove depth design where discharge grooves have different depths than rhombic grooves, and adjacent grooves may have varying depths. This asymmetric structure creates progressive stress relief zones that guide stress distribution more effectively than uniform groove designs, reducing maximum stress concentration points
Solution Approach 3:
The invention introduces a third dimension by varying groove depths to create hierarchical stress distribution zones. The multi-level groove structure (with different depths) adds vertical dimensionality to the stress management system, allowing stress to be distributed through multiple depth levels rather than a single plane, thereby reducing peak stress values
2Strength
If the tray bottom plate is made thicker or more rigid to increase bearing capacity, then the tray can better support LCD assemblies, but the complexity of manufacturing increases and the tray becomes more prone to stress concentration at the bottom
Solution Approach 1:
Instead of increasing overall plate thickness, the patent segments the bottom plate into multiple groove zones with varying depths. This segmentation provides enhanced bearing capacity through distributed stress management while maintaining a relatively simple single-layer plate structure, avoiding the complexity of multi-layer or variable-thickness constructions
Solution Approach 2:
The groove depths are optimized locally to match the stress distribution patterns expected during transportation. Areas with higher stress concentration risk have deeper discharge grooves, while other areas have shallower grooves. This local optimization provides enhanced bearing capacity where needed without unnecessarily increasing complexity or material usage across the entire plate
Data Source
AI summary
The invention provides a tray for packaging LCD assemblies, which includes a bottom plate. The bottom plate is provided with a plurality of rhombic grooves which are arranged side by side, and a plurality of discharge grooves for buffering stress concentration are arranged around the rhombic grooves. Because the bottom plate of the tray of the invention is designed with various types of stress concentration factors which are mutually associated, and the rhombic grooves of the stress concentration factors form a plurality of stress concentration zones on the bottom plate of the tray, the stress concentration in the center of the bottom plate can be effectively decreased. In addition, the discharge grooves are arranged around the rhombic grooves in the invention, and the stress concentration of the rhombic grooves is decreased by the discharge grooves. By the design of the aforementioned stress concentration factors, the stress and strain in the center of the bottom plate of the tray can be decreased, thereby preventing the tray from deforming largely because of excessive stress concentration to damage the LCD assemblies.


