Liquid Crystal Module Bus Architecture for Signal Integrity
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Solution Overview
Problem
Conventional liquid crystal modules face challenges in efficiently transmitting data signals, power signals, and gamma correction signals due to high resistance in conventional wirings, leading to signal distortion and increased power consumption and electromagnetic interference.
Innovation Solution
The implementation of a point-to-point architecture using chip on glass (COG) technology with flexible printed circuits (FPCs) and dual damascene copper process on the glass substrate, reducing signal distortion and power consumption by improving conductivity and reducing the number of required FPCs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wirings are used to transmit data signals, power signals and gamma correction signals, then the liquid crystal module can be manufactured with standard processes, but signal distortion occurs and power consumption increases due to high resistance
Solution Approach 1:
The patent changes the material parameter of the wiring from conventional materials to copper material, which has lower electrical resistance. This parameter change reduces signal distortion and power consumption while maintaining compatibility with standard manufacturing processes through the dual damascene copper process.
Solution Approach 2:
The patent employs a composite structure combining copper wiring with dual damascene process integration on the glass substrate. This composite approach leverages the high conductivity of copper while utilizing existing semiconductor manufacturing techniques to achieve both performance improvement and manufacturing feasibility.
2Object-generated harmful factors
If conventional wirings with high resistance are used, then the liquid crystal module structure can be simplified, but electromagnetic interference increases and signal integrity deteriorates
Solution Approach 1:
By changing the wiring material to copper with superior electrical conductivity, the patent reduces electromagnetic interference generated during signal transmission. This parameter change addresses the harmful effects without requiring fundamental structural redesign, as the dual damascene process integrates seamlessly with existing fabrication workflows.
3Reliability
If the number of FPCs is increased to improve signal transmission, then signal quality improves, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent changes the electrical resistance parameter of the wiring by using copper material, which allows for reduced wiring complexity while maintaining signal transmission quality. The lower resistance enables longer signal paths without degradation, reducing the need for additional FPCs and associated complexity in device assembly and manufacturing.
Data Source
AI summary
A liquid crystal module for flat panel display comprising a glass substrate, a plurality of source drivers, a control board, and at least one bus. The source drivers coupled to the glass substrate utilize the chip on glass (COG) technology. The control board receives a plurality of data signals, a power signal and a gamma correction signal. The at least one bus coupled to the control board and at least one source driver, passes the data signals, the power signal and the gamma correction signal. The source drivers couple to the control board via the bus, each receiving a corresponding data signal. The data signals, conforming to transistor-transistor logic (TTL) standard, are transmitted sequentially on the bus.