LCOS Panel Manufacturing via Post-Singulation Adhesive Connection
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Solution Overview
Problem
Existing LCOS panel manufacturing methods face challenges in reducing panel size and achieving high production yield due to issues like conductive adhesive contamination and complex process requirements, which limit their application in mass production.
Innovation Solution
A method involving a silicon substrate with conductive pads and a transparent substrate with a transparent electrode layer, where a sealing material is dispensed and cured before bonding, creating a space for conductive adhesive connection, preventing contamination and allowing for simpler adhesive dispensing post-singulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductive adhesive is applied before bonding the substrates, then the electrical connection is established, but the conductive adhesive contaminates the liquid crystal causing short circuits
Solution Approach 1:
The patent divides the bonding process into two separate stages: first bonding the substrates without conductive adhesive, then applying conductive adhesive after bonding. This segmentation prevents the harmful factor (conductive adhesive) from being present during the bonding process, eliminating liquid crystal contamination while ensuring electrical connection is established in the second stage.
Solution Approach 2:
The patent performs the substrate bonding action before applying the conductive adhesive. By completing the bonding process first, the liquid crystal is sealed between substrates, preventing subsequent conductive adhesive application from causing contamination. The electrical connection is then established in a safe manner after bonding is complete.
2Reliability
If the extension portions are designed for connection purposes, then the electrical connection is achieved, but the panel size increases
Solution Approach 1:
The patent merges the connection function with the main panel body by applying conductive adhesive at the bonded interface between substrates, eliminating the need for separate extension portions. The electrical connection is achieved within the compact panel structure, reducing overall panel size while maintaining connection reliability.
3Ease of manufacture
If the sealing material and conductive adhesive are coated before bonding, then the bonding process is simplified, but the conductive adhesive passes through the sealing material and contaminates the liquid crystal
Solution Approach 1:
The patent performs substrate bonding before applying conductive adhesive, reversing the conventional sequence. This preliminary bonding action creates a sealed structure that prevents subsequent conductive adhesive from penetrating into the liquid crystal, eliminating contamination while maintaining manufacturing simplicity.
Solution Approach 2:
The patent segments the manufacturing process into distinct stages: bonding first, then conductive adhesive application. This segmentation prevents the harmful interaction between conductive adhesive and liquid crystal that occurs when both are applied before bonding, while keeping the overall process simple and manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces LCOS panel size, enhances production yield by preventing adhesive contamination, and simplifies the manufacturing process, making it suitable for large-scale production.
Implementation Method 1
a sealing material is dispensed and cured before bonding
Implementation Method 2
a conductive adhesive is dispensed into the space to connect the transparent electrode layer to the conductive pad
Data Source
AI summary
A method of manufacturing LCOS panel is disclosed. The method includes: providing a silicon substrate on which at least one conductive pad is formed and a transparent substrate on which a transparent electrode layer is formed; dispensing or coating a sealing material on a predetermined area of the silicon substrate or the transparent substrate; bonding the silicon substrate with the transparent substrate; singulating the bonded silicon substrate and transparent substrate such that at least one space is provided between the silicon substrate and the transparent substrate on an outer side of the sealing material and a part of the transparent electrode layer is exposed in the space; and dispensing a conductive adhesive into the space to connect the transparent electrode layer to the conductive pad. The method is able to achieve a smaller-size of the LCOS panels, a higher production yield and a lower process requirement.