LCP 3D Interconnect Assembly for Embedded Microelectronics
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Solution Overview
Problem
Conventional printed circuit boards (PCBs) with Liquid Crystal Polymer (LCP) layers are limited to functioning solely as substrates for electrical circuits, failing to integrate electronic circuits, components, and fluidic channels or reservoirs that also provide structural support, and they struggle to bridge the gap between semiconductor devices and final end products in terms of size and performance.
Innovation Solution
Embedding semiconductor devices and associated components within an LCP assembly, using advanced fabrication techniques to create a 3-D interconnect structure that integrates electronic circuits, components, and fluidic channels, allowing direct die attach and fine-line printed circuits, reducing terminal pitch, and enabling high-density integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional PCBs with LCP layers are used as substrates for electrical circuits, then the structural support function is provided, but the functional density is low and electronic components cannot be embedded within the structure
Solution Approach 1:
The patent merges multiple functions (structural support, electrical circuits, fluidic channels, and component housing) into a single LCP assembly. The LCP material serves as both the structural substrate and the embedding medium for electronic components, eliminating the need for separate PCB, housing, and fluidic channel components.
Solution Approach 2:
The LCP assembly is designed to perform multiple functions simultaneously: it provides mechanical structural support, serves as a substrate for electrical circuits, contains embedded fluidic channels, and houses electronic components. This multi-functionality increases functional density while reducing overall device complexity.
2Quantity of substance
If semiconductor devices are mounted on conventional PCBs, then electrical connections are established, but the terminal pitch is large and integration density is limited
Solution Approach 1:
The patent transitions from two-dimensional mounting of semiconductor devices on PCB surfaces to three-dimensional embedding within the LCP assembly. This allows components to be positioned in multiple layers and orientations, significantly increasing integration density while reducing terminal pitch through vertical stacking and closer spacing.
3Length of moving object
If semiconductor packages are used, then device protection is provided, but the overall device size increases and functional density decreases
Solution Approach 1:
The protective function traditionally provided by separate semiconductor packages is merged into the LCP assembly itself. The LCP material encapsulates and protects embedded components while providing structural support, eliminating the need for additional protective packaging and reducing overall device size.
4Adaptability or versatility
If LCP layers are fabricated as traditional PCBs, then electrical circuits are supported, but fluidic channels and reservoirs cannot be integrated within the same structure
Solution Approach 1:
The LCP assembly is designed to perform multiple functions simultaneously: it provides electrical circuit support through embedded traces and conductors, while also containing integrated fluidic channels and reservoirs. This multi-functionality allows the same structure to handle both electrical and fluidic operations without requiring separate components.
Solution Approach 2:
The LCP assembly utilizes composite material properties, combining the electrical insulation and mechanical strength of LCP with embedded conductive materials for circuits and fluidic pathways. This composite approach enables simultaneous integration of electrical and fluidic functions within a single monolithic structure.
Data Source
AI summary
Embodiments described herein can include multi-layer circuits within a liquid crystal polymer (LCP) material to define a 3-D interconnect structure that connects the microelectronics features, devices, components and electrical interfaces. In addition, mechanical functions can be embedded in a fashion and proximity such that the embedded electronics can interface and interact with each other as well as introduced conditions relevant to the function of the device and the outside world or environment it is exposed to.