Liquid Crystalline Polymer Camera Module for Thermal Misalignment

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Solution Overview

Problem

Camera modules in electronic devices face increased power consumption and heat production due to complexity, leading to optical misalignment issues caused by polymeric materials with high thermal expansion coefficients.

Innovation Solution

A polymer composition comprising a liquid crystalline polymer matrix and inorganic filler particles, which exhibits high thermal conductivity and low linear thermal expansion, minimizing heat-related misalignment and maintaining mechanical properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional polymeric materials (e.g., polycarbonates) are used in camera modules, then ease of manufacture is improved, but optical misalignment occurs due to high coefficient of linear thermal expansion when heat is generated from increased power consumption

Engineering Contradiction:
Improveease of manufactureVSAvoidoptical misalignment
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent employs a composite material system consisting of a polymer matrix combined with specific inorganic fillers (such as metal particles, metal oxides, or carbides) to create a material that maintains the ease of manufacturing of polymers while achieving low thermal expansion coefficients and high thermal conductivity, thereby preventing optical misalignment in camera modules

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent modifies the thermal properties of the polymer material by changing its compositional parameters - specifically by incorporating inorganic fillers with low thermal expansion coefficients and high thermal conductivity into the polymer matrix, thereby transforming the material's thermal expansion behavior from high to low while maintaining processability

Inventive Principle:
Principle #35Parameter changes

2Temperature

If polymer materials with high thermal conductivity are used to manage heat, then thermal management is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvethermal managementVSAvoidmanufacturing complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent achieves high thermal conductivity by selecting and optimizing the type, size, shape, and distribution of inorganic filler particles within the polymer matrix, along with controlling the filler loading concentration, thereby tuning the thermal conductivity parameter to achieve effective heat management without requiring complex cooling systems or additional thermal management components

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The polymer composition effectively manages heat transfer and maintains mechanical integrity, reducing optical misalignment and improving thermal management in camera modules.

Implementation Method 1

The polymer composition exhibits an in-plane thermal conductivity of about 2.5 W/m-K or more

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The polymer composition exhibits a mean coefficient of linear thermal expansion of about 50° C.−1 or less

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS20220243055A1Camera Module Containing A Polymer Composition
Publication Date: 2022.08.04 TICONA LLC
  • US20220243055A1 patent drawing
  • US20220243055A1 patent drawing
  • US20220243055A1 patent drawing

AI summary

A camera module comprising a polymer composition that includes a polymer matrix containing a liquid crystalline polymer and a plurality of inorganic filler particles is provided. The polymer composition exhibits an in-plane thermal conductivity of about 2.5 W/m-K or more as determined in accordance with ASTM E1461-13, and a mean coefficient of linear thermal expansion of about 50° C.−1 or less as determined in a direction transverse to a flow direction in accordance with ISO 11359-2:1999 over a temperature range of from −45° C. to 200° C.