LCP Composite Insulating Substrate for High-Frequency Signal Transmission
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Solution Overview
Problem
Conventional copper foil substrates, such as FR4 plates made of epoxy resin, fail to meet the requirements of high-frequency communication due to inadequate electrical properties like dielectric constant and dissipation factor, necessitating a substrate material with a high dielectric constant and low dissipation factor.
Innovation Solution
A composite insulating substrate is formed using 100 parts by weight of liquid crystal polymer and 0.5 to 85 parts by weight of a dielectric additive, including ceramic, modified ceramic, conductive, or organic materials, which increases the dielectric constant while maintaining a low dissipation factor, ensuring effective signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional FR4 substrate made of epoxy resin is used, then cost is reduced and manufacturing is simplified, but electrical properties (dielectric constant and dissipation factor) are insufficient for high-frequency communication
Solution Approach 1:
The patent uses a composite material system consisting of liquid crystal polymer (LCP) as the base resin combined with specific fillers (such as ceramic particles or fibers) to create a substrate material that achieves both high-frequency electrical performance and manufacturability. The LCP matrix provides inherent low dissipation factor while the filler enhances dielectric constant, creating a composite that outperforms conventional FR4 while remaining compatible with standard PCB manufacturing processes.
Solution Approach 2:
The patent modifies the electrical parameters of the substrate material by selecting liquid crystal polymer with specific molecular structure and orientation characteristics that inherently provide low dissipation factor at high frequencies. Additionally, the composition ratios of LCP to filler are optimized to achieve target dielectric constant values while maintaining processability and electrical performance.
2Reliability
If liquid crystal polymer with high dielectric constant is used, then signal transmission quality is improved, but manufacturing precision and process control become more difficult
Solution Approach 1:
The patent carefully controls the composition parameters of the LCP-based composite, including the ratio of LCP to filler (typically 90:10 to 70:30 by weight), particle size distribution of fillers, and processing temperatures. These parameter optimizations ensure that the material maintains good flow characteristics during molding while achieving the desired high dielectric constant and low dissipation factor, thus balancing performance with manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite insulating substrate achieves a high dielectric constant of 3 to 200 with a low dissipation factor of 0.003 to 0.008, enhancing signal speed and frequency while maintaining stability under high temperature and humidity conditions, suitable for high-frequency communication applications.
Implementation Method 1
The composite insulating substrate achieves a high dielectric constant of 3 to 200 with a low dissipation factor of 0.003 to 0.008, enhancing signal speed and frequency
Data Source
AI summary
The disclosure provides a composite for forming an insulating substrate. The composite includes 100 parts by weight of a liquid crystal polymer and 0.5-85 parts by weight of a dielectric additive. The liquid crystal polymer has a repeating unit represented byin which Ar is 1,4-phenylene, 1,3-phenylene, 2,6-naphthalene, or 4,4′-biphenylene, Y is —O— or —NH—, and X is carboxamido, imido/imino, amidino, aminocarbonylamino, aminothiocarbonyl, aminocarbonyloxy, aminosulfonyl, aminosulfonyloxy, aminosulfonylamino, carboxyl ester, (carboxyl ester)amino, (alkoxycarbonyl)oxy, alkoxycarbonyl, hydroxyamino, alkoxyamino, cyanato, isocyanato, or a combination thereof.