LCP Implantable Electrode Fabrication via Rigid Backing Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge lies in manufacturing implantable electrode arrays with liquid crystal polymer (LCP) layers that are already in sheet form, as these sheets often seat unevenly on the underlying surface, making it difficult to ensure that conductive layers and electrodes remain bonded to the insulating layer, leading to potential delamination and malfunction when exposed to body fluids.
Innovation Solution
A method involving the application of a thin polymer film to a backing with an adhesive, followed by pressure and heat to ensure uniform bonding, allowing for the formation of multi-layer assemblies with LCP coupons that are structurally sound and free from folds and bumps, facilitating the batch processing of separate sections to form finished assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If LCP sheets are applied directly to the underlying surface, then the manufacturing process is simple, but the sheets seat unevenly causing delamination and malfunction
Solution Approach 1:
The LCP coupon is bonded to a rigid backing substrate before application to the underlying surface. This preliminary bonding action creates a pre-assembled unit with uniform support, eliminating the uneven seating problem that occurs when LCP sheets are applied directly. The backing substrate serves as a temporary support structure that maintains proper positioning and bonding integrity throughout the manufacturing process.
Solution Approach 2:
A rigid backing substrate is introduced as an intermediary element between the LCP coupon and the underlying surface. This intermediary provides a flat, stable bonding surface that ensures uniform contact and adhesion. The backing substrate acts as a mediator that transfers the bonding force evenly across the LCP layer, preventing delamination while maintaining manufacturing feasibility.
2Manufacturing precision
If pressure and heat are applied to bond the polymer film, then bonding uniformity is improved, but manufacturing complexity increases
Solution Approach 1:
The bonding process utilizes controlled changes in temperature and pressure parameters to achieve uniform bonding of the polymer film to the backing substrate. By applying heat and pressure within specific ranges, the adhesive properties of the polymer are optimized, ensuring consistent adhesion across the entire surface. This parameter control approach maintains manufacturing precision while keeping the process relatively simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures a structurally sound assembly with reduced mechanical stress, enabling the fabrication of implantable electrode arrays with LCP layers that are less prone to water absorption and delamination, thus maintaining the integrity and functionality of the device when implanted.
Implementation Method 1
an adhesive layer is disposed on one surface of the rigid backing substrate... the coupon is bonded to the adhesive layer
Implementation Method 2
pressure is applied to the coupon while the assembly is at a temperature above ambient temperature... pressure ensures that the film is at a relatively constant height above the backing
Data Source
AI summary
Plural medical device formed from one or more layers of thin film polymer are assembled from a single polymer coupon. Initially the coupon is bonded to a rigid substrate. Force, heat and a suction are selectively applied to the coupon to ensure that it has a consistent height across its exposed surface. Once the polymer coupon is bonded the components forming the medical device are attached to the coupon and the coupon is shaped to form the individual medical devices. Shaped sections of the coupon are then lifted off the rigid backing. The lifted off sections on which the components were attached are the medical devices.