LCP Electronic Package for Flexible Biomedical Sensing
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Solution Overview
Problem
Current electronic packaging technologies fail to provide ultra-thin, flexible, chemically resistant, and affordable solutions for embedding semiconductor dies, particularly for emerging wireless communication and biomedical sensing applications, where existing methods do not utilize liquid crystal polymer (LCP) materials effectively.
Innovation Solution
A low-profile electronic package is developed using a liquid crystal polymer (LCP) body surrounding a semiconductor die with conductive pillars and interconnect layers, allowing for near-hermetic sealing and biocompatibility, achieved through a lamination process with electroplated conductive connections and vias, enabling flexibility and reduced production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional packaging materials (laminate and polymeric circuit boards) are used for embedded electronics, then manufacturing compatibility is improved, but moisture protection and hermetic sealing deteriorate
Solution Approach 1:
The patent uses liquid crystal polymer (LCP) material that combines the manufacturing compatibility of conventional circuit board materials with superior moisture barrier properties and near-hermetic sealing capabilities, creating a composite material solution that resolves the contradiction between ease of manufacture and moisture protection
2Area of stationary object
If package size is reduced to meet market demand, then footprint is improved, but structural robustness and protection deteriorate
Solution Approach 1:
The patent employs thin-film LCP encapsulation layers that provide robust moisture protection and structural integrity in ultra-thin form factors, enabling small footprint while maintaining protection through flexible yet durable encapsulation structures
Solution Approach 2:
The multi-layer LCP composite structure provides enhanced mechanical strength and moisture barrier properties in a thin profile, resolving the contradiction between reduced footprint and maintained structural robustness
3Ease of manufacture
If LCP bond layers with low melting temperature are used to adhere LCP core layers, then bonding processability is improved, but thermal resistance and heat dissipation deteriorate
Solution Approach 1:
The patent changes the material parameters by using LCP with controlled melting temperature ranges (285°C for bond layers, 315°C for core layers) to enable easy bonding while managing thermal properties, resolving the contradiction between bonding processability and heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The LCP-based package offers high flexibility, biocompatibility, and reduced assembly costs, suitable for surgically implanted devices and complex architectures, while maintaining stable dielectric properties even when exposed to moisture.
Implementation Method 1
the low melting temperature (285° C.) LCP bond layers 32, 36 and 40 are used to adhere the generally thicker higher melting temperature (315° C.) LCP core layers 30, 34, 38 and 42
Implementation Method 2
LCP bond layers 32, 36 and 40 are used to adhere the generally thicker higher melting temperature (315° C.) LCP core layers 30, 34, 38 and 42
Data Source
AI summary
An electronic package includes a semiconductor die, conductive pillars extending outwardly from the semiconductor die, and a liquid crystal polymer (LCP) body surrounding the semiconductor die and having openings therein receiving respective ones of the conductive pillars. A first interconnect layer is on the LCP body and contacts the openings. Conductive bodies are in the openings to connect the conductive pillars to the first interconnect layer.