LCP Embedded Microelectronics With 3D Interconnects for High-Density Circuits
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Solution Overview
Problem
Conventional methods for integrating semiconductor devices into printed circuit boards (PCBs) face limitations in terminal pitch and circuit line/space features, leading to larger form factors and reduced performance in end products, especially in applications requiring high-density circuitry and complex interconnects.
Innovation Solution
Embedding semiconductor devices and components within a Liquid Crystal Polymer (LCP) assembly, which allows for direct die attach and fine-line printed circuits, enabling 3-D interconnect structures and integrating electronic circuits, fluidic channels, and mechanical functions directly into the LCP material, thus merging semiconductor packages and printed circuit assemblies into an integrated end product.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional PCB methods are used to integrate semiconductor devices, then the assembly process is straightforward, but the terminal pitch and circuit line/space features are limited, resulting in larger form factors and reduced performance
Solution Approach 1:
The patent merges the PCB substrate and semiconductor package into a single integrated LCP assembly. The LCP material serves as both the substrate and the package encapsulation, eliminating the need for separate assembly steps and enabling finer terminal pitch and circuit features that would be impossible with conventional multi-component PCB methods
Solution Approach 2:
The patent uses Liquid Crystal Polymer (LCP) as a composite material that combines the properties of a flexible PCB substrate with the protective encapsulation functions of a semiconductor package. This composite material enables both high manufacturing precision for fine features and ease of integration in a single material system
2Ease of manufacture
If semiconductor devices are mounted on separate PCBs and then assembled into devices, then the manufacturing process is simple, but the functional density is low and the device size is large
Solution Approach 1:
The patent implements a nested structure where semiconductor dies are embedded within the LCP substrate itself. The LCP material encapsulates the dies and provides interconnect pathways, creating a nested arrangement that maximizes functional density while maintaining manufacturing simplicity through a single integrated structure
Solution Approach 2:
The patent transitions from traditional 2D PCB mounting to 3D embedded interconnects within the LCP material. This dimensional change allows circuit pathways to route through the thickness of the substrate, enabling higher functional density without increasing the planar footprint
3Device complexity
If traditional PCB assemblies are used, then the interconnect distances are long, but the manufacturing complexity is low
Solution Approach 1:
The patent segments the interconnect pathway into multiple thin LCP layers with embedded conductive traces. This segmentation allows the signal to travel through shorter vertical pathways in each layer rather than long horizontal pathways on a single PCB plane, reducing overall interconnect distance while maintaining manufacturing feasibility
Data Source
AI summary
Embodiments described herein can include multi-layer circuits within a liquid crystal polymer (LCP) material to define a 3-D interconnect structure that connects the microelectronics features, devices, components and electrical interfaces. In addition, mechanical functions can be embedded in a fashion and proximity such that the embedded electronics can interface and interact with each other as well as introduced conditions relevant to the function of the device and the outside world or environment it is exposed to.