Light Source Package Structure with LCP Surrounding Wall

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional light source package structures, such as TO-CAN packages, face challenges in meeting modern requirements due to lack of structural improvements, particularly in terms of oxygen/water vapor isolation, high temperature resistance, and adhesion issues during thermal cycling and shock tests.

Innovation Solution

A light source package structure utilizing a surrounding wall made of liquid crystal polymer with a low dielectric constant and fewer polar groups, combined with an active molecular layer formed through UV or UVO treatment to enhance adhesion, allowing for improved oxygen/water vapor isolation and high temperature resistance, and secure bonding of light permeable elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional TO-CAN package structure is used, then manufacturing simplicity is maintained, but oxygen/water vapor isolation capacity and high temperature resistance are insufficient

Engineering Contradiction:

Improveoxygen/water vapor isolation capacityVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies composite materials by using liquid crystal polymer (LCP) as the surrounding wall material. LCP combines low polar group content for excellent oxygen/water vapor isolation with high temperature resistance properties, creating a multi-functional material solution that addresses multiple reliability requirements simultaneously while maintaining structural simplicity.

Inventive Principle:

Principle #40Composite materials

2Strength

If conventional TO-CAN package structure is used, then structural simplicity is maintained, but adhesion strength during thermal cycling and shock tests is insufficient

Engineering Contradiction:

Improveadhesion strengthVSAvoidsurface treatment process complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by performing UV or UVO treatment on the LCP surrounding wall surface before bonding the light permeable element. This pre-treatment creates an active molecular layer with enhanced adhesion properties in advance, ensuring strong bonding strength during subsequent thermal cycling and shock tests without requiring complex structural modifications.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If liquid crystal polymer is used for surrounding wall, then oxygen/water vapor isolation and high temperature resistance are improved, but dielectric constant remains low for high frequency applications

Engineering Contradiction:

Improvehigh temperature resistanceVSAvoidhigh frequency application suitability

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent applies parameter changes by selecting liquid crystal polymer with specific material parameters: low dielectric constant and low loss tangent. These parameter selections make the material suitable for both high temperature resistance and high frequency applications, expanding the adaptability of the package structure across different application scenarios.

Inventive Principle:

Principle #35Parameter changes

4Strength

If active molecular layer is formed through UV treatment, then adhesion is enhanced, but manufacturing process complexity increases

Engineering Contradiction:

Improvebonding strengthVSAvoidmanufacturing process simplicity

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent applies mechanics substitution by replacing mechanical surface preparation methods with UV or UVO light treatment. This substitution creates the active molecular layer through photochemical reactions rather than mechanical abrasion or chemical etching, achieving enhanced adhesion strength while maintaining relatively simple manufacturing processes that are easily integrated into existing production lines.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides enhanced reliability and performance by ensuring strong adhesion and durability of the light source package structure, suitable for high power and high frequency applications, while maintaining structural integrity and preventing element detachment during thermal stress.

Implementation Method 1

The liquid crystal polymer has less polar groups so that the liquid crystal polymer can provide excellent oxygen/water vapor isolation capacity

Methodology Applied

Scientific EffectOxygen/water vapor isolation: Permeation

Implementation Method 2

an active molecular layer formed through UV or UVO treatment to enhance adhesion

Methodology Applied

Scientific EffectUV treatment: Photopolymerisation

Data Source

PatentUS11289880B2Light source package structure

Publication Date: 2022.03.29 LITE ON OPTO TECH (CHANGZHOU) CO LTD

AI summary

A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a surrounding wall, a light emitting unit, an adhesive, and a light permeable element. The surrounding wall is annular with step structure and includes an upper tread surface arranged away from the substrate, an upper riser surface connected to an inner edge of the upper tread surface, a lower tread surface disposed at an inner side of the upper riser surface, an accommodating groove disposed between the lower tread surface and the upper riser surface, and a lower riser surface connected to an inner edge of the lower tread surface and arranged away from the upper tread surface. The lower riser surface and the first surface jointly define a receiving space.