LCP Micro-Electrode Array Package for In Vivo Sealability
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Solution Overview
Problem
Conventional micro-electrode array packages using polymers like polyimide and parylene are susceptible to moisture and ions in vivo, limiting their application duration and requiring a novel method for manufacturing that addresses poor processability and sealability issues.
Innovation Solution
A micro-electrode array package using liquid crystal polymer (LCP) with a substrate and cover section, where the electrode section is formed on the substrate, and the cover section is adhered to create a sealed space, eliminating the need for plasma etching and using a single material for encapsulation, allowing for high-density multi-channel systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional polymers (polyimide, parylene) are used for micro-electrode array packages, then ease of manufacture is improved, but reliability deteriorates due to susceptibility to moisture and ions in vivo
Solution Approach 1:
The patent changes the material parameter from conventional polymers to liquid crystal polymer (LCP), which has superior resistance to moisture and ions while maintaining manufacturability. This material substitution resolves the contradiction by providing both reliability in vivo and ease of manufacture through LCP's inherent properties
Solution Approach 2:
The patent uses LCP as a composite material that combines the benefits of polymer processability with enhanced environmental resistance. The LCP material integrates multiple functional properties including moisture resistance, ion resistance, and manufacturability, resolving the contradiction between ease of manufacture and reliability
2Reliability
If LCP is used for micro-electrode array packages, then reliability is improved by resisting moisture and ions in vivo, but device complexity increases due to poor processability
Solution Approach 1:
The patent changes the processing parameters and methods for LCP to simplify manufacturing. By optimizing the fabrication process for LCP materials, the patent maintains reliability while reducing device complexity through streamlined manufacturing procedures
3Manufacturing precision
If plasma etching is used in the manufacturing process, then manufacturing precision is improved, but productivity deteriorates due to long processing time and damage to metal patterns
Solution Approach 1:
The patent replaces the plasma etching process with an alternative manufacturing method that avoids long processing times and metal pattern damage. This substitution maintains manufacturing precision while significantly improving productivity by eliminating the time-consuming plasma etching step
Solution Approach 2:
The patent extracts or removes the plasma etching step from the manufacturing process entirely, replacing it with a more efficient method. This eliminates the productivity bottlenecks associated with plasma etching while preserving the necessary manufacturing precision through alternative precision-based fabrication techniques
4Ease of operation
If encapsulated packages are designed with small dimensions for user comfort, then ease of operation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent changes the material properties and manufacturing parameters to enable precise fabrication of small-dimensioned packages. By using LCP and optimized processing methods, the patent achieves the required manufacturing precision for compact dimensions while maintaining ease of operation for the final device
Data Source
AI summary
Disclosed herein is a micro-electrode array package including a micro-electrode array comprising: a substrate section including a liquid crystal polymer; an electrode section collecting and transferring bio-signals; and a cover section insulating and protecting the electrode section and including a liquid crystal polymer, wherein the electrode section is disposed in contact with one surface of the substrate section, the cover section is adhered in contact with the surface of the substrate section on which the electrode section is disposed, and a space independent from the external environment is formed between the substrate section and the cover section adhered thereto. Disclosed herein too is a method for manufacturing a micro-electrode array package, including: forming alignment holes in a substrate section including a liquid crystal polymer and a cover section including a liquid crystal polymer; forming site window holes for an electrode section-exposure in the cover section; forming an electrode section on one surface of the substrate section; aligning the substrate section and the cover section by the alignment holes, and adhering the substrate section and the cover section with each other; and cutting the substrate section and the cover section adhered thereto to provide an outer shape.