Low dielectric, high heat-dissipation liquid crystal polymer composition for millimeter wave band, and method for producing same
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Solution Overview
Problem
Existing dielectric materials for PCB copper-clad laminate boards in 5G wireless communication face challenges with high dielectric loss, high hygroscopicity, poor mechanical properties, and high production costs, and have limitations in reducing transmission loss, thermal conductivity, and high thermal conductivity, and high production costs, especially at high frequencies above 28 GHz.
Innovation Solution
A liquid-crystal polymer composition is developed with a mesogen core, silane-based group, and polymerization reactive group, forming a polymer network through bonding, which reduces dielectric loss and enhances thermal conductivity, allowing low-temperature processing and improved mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If existing polyimide-based materials are used for dielectric materials in 5G wireless communication, then the materials can be processed at relatively low temperatures, but they exhibit high dielectric loss and high hygroscopicity which limit transmission loss reduction in high-frequency bands of 28 GHz or higher
Solution Approach 1:
The patent changes the chemical structure parameters of the dielectric material by introducing liquid crystal polymer segments with specific mesogenic groups and silane-based crosslinking structures. This structural parameter change reduces the dielectric constant and dielectric loss tangent, enabling lower energy loss at millimeter wave frequencies while maintaining processing feasibility
Solution Approach 2:
The patent creates a composite material system combining liquid crystal polymer segments, silane-based groups for crosslinking, and polymerization reactive groups. This composite structure integrates the low dielectric loss characteristics of liquid crystal polymers with the enhanced mechanical and thermal properties provided by silane crosslinking, resolving the contradiction between energy loss and transmission reliability
2Ease of manufacture
If various dielectric materials such as modified polyimide, olefin series, and epoxy series are developed for high frequencies, then they can be processed, but they exhibit high dielectric loss, high hygroscopicity, poor mechanical properties, poor heat resistance, and poor processability
Solution Approach 1:
The patent modifies the chemical composition parameters by incorporating liquid crystal polymer segments with specific molecular structures that provide low dielectric loss, and adds silane-based groups that enable crosslinking. This parameter optimization achieves both low energy loss and good processability simultaneously
Solution Approach 2:
The patent applies local quality enhancement by introducing silane-based crosslinking structures at specific locations within the polymer matrix. This localized crosslinking improves mechanical properties and heat resistance in critical areas while maintaining the overall low dielectric loss characteristics of the liquid crystal polymer segments
3Loss of energy
If liquid-crystal polymers of polyester resins are used for dielectric materials, then they can provide low dielectric loss, but they cause deterioration in physical properties and high production costs due to high-temperature processes
Solution Approach 1:
The patent changes the processing temperature parameter by introducing polymerization reactive groups that enable low-temperature curing. This allows the liquid crystal polymer segments to be processed at lower temperatures, preventing deterioration of physical properties and reducing production costs while maintaining low dielectric loss characteristics
Solution Approach 2:
The patent introduces polymerization reactive groups as intermediaries that facilitate low-temperature processing. These reactive groups act as mediators between the liquid crystal polymer segments and the curing process, enabling crosslinking at lower temperatures without compromising the low dielectric loss properties of the material
4Temperature
If geometric heat-dissipation design or blackening of heat dissipating structures is used, then surface area is maximized or radiation efficiency is increased, but it is difficult to reduce rapidly increasing thermal density of devices
Solution Approach 1:
The patent changes the thermal conductivity parameter of the dielectric material itself by incorporating liquid crystal polymer segments with high thermal conductivity along the mesogen axis. This intrinsic material parameter change enables effective heat dissipation without requiring complex geometric designs or additional heat dissipation structures
Solution Approach 2:
The patent makes the dielectric material multi-functional by simultaneously providing electrical insulation, low dielectric loss, and high thermal conductivity. The liquid crystal polymer segments serve multiple functions: maintaining low dielectric loss for signal transmission and conducting heat away from hot spots, eliminating the need for separate heat dissipation structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves low dielectric loss, high thermal conductivity, and low hygroscopicity, enabling effective heat dissipation and reduced production costs, suitable for high-frequency applications like 5G and 6G communication devices.
Implementation Method 1
the silane-based group (S) and the polymerization reactive group (F) may undergo a polymerization reaction
Implementation Method 2
capable of imparting low-dielectric and high-strength characteristics based on mesogens exhibiting high thermal conductivity
Data Source
AI summary
Proposed is a dielectric material of a liquid-crystal polymer composition including a low-dielectric and high-heat-dissipating liquid-crystal-material monomer for a millimeter wave band and a polymer thereof, and more particularly, a liquid-crystal polymer composition including a low-dielectric and high-heat-dissipating liquid-crystal-material monomer for a millimeter wave band and a polymer thereof, the liquid-crystal-material monomer including a mesogen core, a silane-based group, and a polymerization reactive group.