LCP Sealing Structure for Crack-Resistant Semiconductor Packages

Solution Overview

Problem

Semiconductor packages sealed with glass epoxy resin are prone to cracks when used in vehicles, leading to breakage due to the material's lower material strength and susceptibility to stress.

Innovation Solution

Using a liquid crystal polymer (LCP) as the sealing member, which has higher material strength and is softer than glass epoxy resin, to suppress crack introduction and enhance durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If glass epoxy resin is used as the sealing member, then the sealing member provides basic sealing function, but the material strength is low and cracks occur easily under stress

Engineering Contradiction:

Improvematerial strengthVSAvoidcrack resistance

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent changes the material parameters by transitioning from glass epoxy resin to liquid crystal polymer (LCP), which has superior mechanical strength and crack resistance properties. This material substitution directly addresses the contradiction by providing both higher strength and improved reliability under stress conditions.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs liquid crystal polymer as a composite material that combines the benefits of high strength, flexibility, and crack resistance. The LCP material acts as a composite solution that resolves the contradiction between needing sufficient strength while maintaining reliability against crack formation in vehicle environments.

Inventive Principle:

Principle #40Composite materials

2Reliability

If glass epoxy resin is used as the sealing member, then the sealing structure is simple, but the sealing member is prone to breakage due to lower material strength

Engineering Contradiction:

ImprovedurabilityVSAvoidmaterial strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent changes the material parameters by transitioning from glass epoxy resin to liquid crystal polymer (LCP), which has superior mechanical strength and crack resistance properties. This material substitution directly addresses the contradiction by providing both higher strength and improved reliability under stress conditions.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If a softer material is used to suppress crack introduction, then the material becomes more flexible, but the structural rigidity may be reduced

Engineering Contradiction:

Improvecrack resistanceVSAvoidstructural rigidity

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent employs liquid crystal polymer as a composite material that combines the benefits of high strength, flexibility, and crack resistance. The LCP material acts as a composite solution that resolves the contradiction between needing sufficient strength while maintaining reliability against crack formation in vehicle environments.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS20250253198A1Semiconductor package, electronic device, and method for manufacturing semiconductor package

Publication Date: 2025.08.07 DENSO CORP

AI summary

A semiconductor package includes a semiconductor chip formed with a semiconductor element, a heat radiating member on which the semiconductor chip is mounted via a bonding member, and a sealing member sealing the semiconductor chip. The sealing member includes a part made of a stack of a plurality of liquid crystal polymer films.