LDS Antenna Module With Ferrite Shielding for Thin NFC Terminals
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Solution Overview
Problem
Conventional wireless communication terminals with NFC antennas using flexible printed circuit boards (FPCB) face challenges in reducing thickness, which hinders the trend of slimming the devices for improved portability and electromagnetic wave interference.
Innovation Solution
An antenna module employing a Laser Direct Structuring (LDS) method for forming antennas on a carrier, combined with a shielding layer made of ferrite on the opposite surface to reduce thickness and enhance electromagnetic wave shielding, thereby improving radiation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible printed circuit board (FPCB) is used for the NFC antenna, then the antenna can be flexibly installed, but the antenna module thickness increases
Solution Approach 1:
The patent changes the fundamental parameter of antenna substrate from FPCB to a rigid board with LDS (Laser Direct Structuring) technology. This parameter change enables the antenna to be formed directly on the board surface through laser processing and plating, eliminating the need for thick FPCB layers while maintaining installation flexibility through integrated design.
Solution Approach 2:
The patent merges the antenna structure with the board structure by forming the LDS antenna directly on the board surface. The antenna conductor pattern is integrated into the board layer through laser direct structuring and electroplating, combining what were previously separate FPCB antenna and board components into a unified structure, thereby reducing overall thickness.
2Length of stationary object
If the antenna module is thinned to improve portability, then device portability improves, but electromagnetic wave shielding performance deteriorates
Solution Approach 1:
The patent introduces a shielding layer as an intermediary component between the LDS antenna and the external environment. This shielding layer, positioned on the back surface of the board, acts as a mediator that blocks electromagnetic waves from reaching the antenna, providing effective shielding without requiring increased module thickness.
Solution Approach 2:
The patent applies shielding material locally at the back surface of the board in specific regions corresponding to the antenna area. This localized shielding approach provides targeted electromagnetic wave protection exactly where needed, rather than requiring comprehensive thick shielding throughout the entire module, thus maintaining thin overall dimensions while achieving effective EMI protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The LDS method allows for a slim antenna module structure while effectively shielding electromagnetic waves, enhancing antenna performance and maintaining device portability.
Implementation Method 1
by implementing an antenna included in an antenna module used in a wireless communication terminal using a laser direct structuring (LDS) method
Implementation Method 2
providing a shielding layer for shielding against electromagnetic waves on the opposite side of a carrier where the LDS antenna is formed
Data Source
AI summary
An antenna module according to an embodiment of the present disclosure includes an antenna implemented by an LDS method. The antenna module may be used in a wireless communication terminal. The thickness of the antenna module may be reduced, and the radiation performance of the antenna may be improved by effectively shielding against electromagnetic waves by providing a shielding layer for shielding against electromagnetic waves on the opposite side of a carrier where the LDS antenna is formed.