Antenna Structure Manufacturing Using LDS Catalyst Removal
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Solution Overview
Problem
The conventional method for manufacturing antenna structures using the laser-direct-structuring (LDS) technique is complex and costly due to the need for a dielectric layer and adhesive injection for waterproofing, complicating the process and increasing production costs.
Innovation Solution
A method involving a non-conductive frame with a catalyst, where a metal insert is disposed, and an anti-plating resistance layer is formed, then removed using LDS to create a coarsened surface for electroless plating, simplifying the process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dielectric layer and adhesive injection are used in the LDS technique, then the plating stability and waterproofing are improved, but the manufacturing process complexity and production cost increase
Solution Approach 1:
The patent extracts and eliminates the dielectric layer and adhesive injection steps from the conventional LDS process. By directly applying the LDS technique to the substrate without these additional layers, the patent achieves plating stability through the laser-induced catalytic pattern itself, thereby simplifying the manufacturing process while maintaining reliability
Solution Approach 2:
The patent merges the functions of the dielectric layer and adhesive injection into the substrate preparation stage. The substrate is pre-treated with catalyst distribution, and the LDS technique directly creates the plating pattern on this prepared surface, combining multiple functions into a single integrated process that reduces complexity
2Reliability
If a dielectric layer and adhesive injection are used in the LDS technique, then the plating stability and waterproofing are improved, but the production cost increases
Solution Approach 1:
The patent removes the dielectric layer and adhesive injection steps, eliminating the materials and processing costs associated with these components. The direct LDS approach reduces material consumption and manufacturing steps, thereby lowering production cost while maintaining plating stability through the optimized catalyst-based plating process
3Device complexity
If the anti-plating resistance layer is removed by LDS technique, then the manufacturing process is simplified, but the processing time needs to be optimized
Solution Approach 1:
The patent applies preliminary catalyst distribution to the substrate before the LDS process. This pre-preparation ensures that when the anti-plating resistance layer is removed by laser, the catalytic pattern is already in place, allowing immediate plating without additional preparation steps, thus optimizing processing time while maintaining process simplicity
Solution Approach 2:
The patent skips intermediate processing steps by directly transitioning from anti-plating resistance layer removal to plating. The LDS technique efficiently removes the resistance layer and activates the catalytic pattern in a single continuous process, reducing total processing time while keeping the manufacturing process simple
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, reduces production costs, and allows for customized antenna structures while maintaining the efficiency of the LDS technique, decreasing processing time and offering various customization options.
Implementation Method 1
The anti-plating resistance layer on the area of the non-conductive frame is removed by a laser-direct-structuring (LDS) technique
Implementation Method 2
a non-conductive frame containing a catalyst is provided
Data Source
AI summary
A method for manufacturing an antenna structure is disclosed. Employing steps of mixing with a catalyst and embedding a metal insert can simplify steps for manufacturing the antenna structure. Further, a non-conductive frame produced by the process disclosed herein can exhibit waterproof effect. The catalyst mentioned above is mixed with a plastic and then injected into a mold to form the non-conductive frame. The metal insert mentioned above is disposed in the mold before the step of injecting the plastic. Alternatively, the metal insert is embedded in the non-conductive frame after the step of injecting the plastic.