LDS Polymer Composition for High-Dielectric Multi-Antenna Substrates
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Solution Overview
Problem
Existing polymer compositions used in laser direct structuring (LDS) processes for forming MIDs suffer from low dielectric constant and high dissipation factor, which limits their use in applications requiring multiple antennas, and adversely impact mechanical properties and processability.
Innovation Solution
A polymer composition comprising a thermotropic liquid crystalline polymer, laser activatable additive, and dielectric material, which maintains a high dielectric constant (≥10) and low dissipation factor (≤0.1) while ensuring excellent mechanical properties and processability, allowing for the formation of thin substrates with multiple conductive elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional polymer compositions (polycarbonate, ABS, copper chromium oxide spinel, BPADP flame retardant) are used for laser direct structuring, then the material can be activated by laser to form conductive elements, but the flame retardant adversely impacts mechanical properties (deformation temperature under load) and the material has low dielectric constant and high dissipation factor
Solution Approach 1:
The patent removes the harmful flame retardant (BPADP) from the polymer composition while maintaining laser activatability through alternative mechanisms. The composition uses polycarbonate and ABS blend with copper chromium oxide spinel and organic peroxide, eliminating the substance that degraded mechanical properties while preserving the ability to form conductive elements through laser activation.
Solution Approach 2:
The patent employs a composite polymer composition consisting of polycarbonate, ABS, copper chromium oxide spinel, and organic peroxide. This composite formulation achieves both laser activatability and improved mechanical properties, specifically raising the deformation temperature under load to 220°C or higher, while also achieving a dielectric constant of 3.0 or higher and dissipation factor of 0.030 or lower.
2Ease of manufacture
If conventional polymer compositions with flame retardants are used, then laser direct structuring can be performed, but the material is unsuitable for lead free soldering processes that require high temperature resistance
Solution Approach 1:
The patent eliminates the flame retardant BPADP that limited high-temperature resistance, enabling the material to withstand lead-free soldering processes while maintaining laser direct structuring capability through the alternative formulation with organic peroxide and copper chromium oxide spinel.
Solution Approach 2:
The composite formulation of polycarbonate, ABS, copper chromium oxide spinel, and organic peroxide creates a material system that simultaneously provides laser activatability and high-temperature resistance for lead-free soldering, achieving both manufacturing requirements without compromise.
3Ease of manufacture
If conventional polymer compositions are used, then the material can be processed for laser direct structuring, but the low dielectric constant and high dissipation factor make it difficult to include more than one antenna in the device
Solution Approach 1:
The patent removes the flame retardant BPADP that caused high dissipation factor, thereby reducing energy loss and enabling multiple antennas to operate simultaneously without excessive electrical interference, while maintaining laser direct structuring processability.
Solution Approach 2:
The composite polymer composition achieves a dielectric constant of 3.0 or higher and dissipation factor of 0.030 or lower, providing the electrical properties necessary for supporting multiple antennas in the device while retaining the ability to be processed through laser direct structuring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of thin substrates with multiple conductive elements, such as antennas, that operate with minimal electrical interference and maintain mechanical integrity across a wide temperature range, facilitating high-speed surface mounting and integration in electronic components.
Implementation Method 1
the polymer composition exhibits a dielectric constant of about 10 or more and a dissipation factor of about 0.1 or less
Implementation Method 2
the polymer composition exhibits a dielectric constant of about 10 or more and a dissipation factor of about 0.1 or less
Implementation Method 3
a computer-controlled laser beam travels over the plastic substrate to activate its surface at locations where the conductive path is to be situated
Data Source
AI summary
A polymer composition that comprises a laser activatable additive, fibrous filler, and dielectric material distributed within a polymer matrix is provided. The polymer matrix contains at least one thermotropic liquid crystalline polymer. Further, the polymer composition exhibits a dielectric constant of about 10 or more and a dissipation factor of about 0.1 or less, as determined at a frequency of 2 GHz.