Lead Acid Electrode Pasting With Ultrasonic Gap Filling

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Solution Overview

Problem

Existing methods for applying paste to lead acid battery electrodes, particularly bipole electrodes, result in voids and gaps at the paste-electrode interface, affecting battery performance and life, and traditional monopole pasting techniques are inadequate for bipole electrodes due to differing paste formulations and mechanical tolerance issues.

Innovation Solution

A manufacturing process utilizing ultrasonic energy and mechanical pressure to fill gaps between the paste and electrode substrate, enabling improved adhesion and interface contact, and a method of layering pastes to optimize performance without compromising on adhesion, energy capacity, or durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional monopole pasting techniques are used on bipole electrodes, then the paste application process is simple, but voids and gaps occur at the paste-electrode interface

Engineering Contradiction:
Improvepaste application processVSAvoidpaste-electrode interface contact
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies ultrasonic vibration during the pasting process to eliminate voids and gaps at the paste-electrode interface. The ultrasonic energy causes the paste to vibrate and flow into irregularities in the electrode substrate, ensuring intimate contact between the paste and substrate while maintaining a simple pasting process.

Inventive Principle:
Principle #18Mechanical vibration

2Stress or pressure

If external plates are used for active material in bipole electrodes, then higher pressures can be applied, but the electrode substrate cannot tolerate the mechanical forces

Engineering Contradiction:
Improvepasting pressureVSAvoidelectrode substrate tolerance
Core Design Contradiction:
Stress or pressureVSStrength

Solution Approach 1:

Instead of applying high mechanical pressure that the electrode substrate cannot tolerate, the patent uses ultrasonic vibration to achieve intimate paste-substrate contact. The vibrational energy allows the paste to flow and conform to the substrate surface without requiring excessive force, thus protecting the electrode substrate from mechanical damage.

Inventive Principle:
Principle #18Mechanical vibration

Solution Approach 2:

The patent replaces the traditional mechanical pressure system with an ultrasonic vibration system. This substitution allows for effective paste application and void elimination without subjecting the electrode substrate to excessive mechanical forces, thereby resolving the contradiction between achieving good contact and protecting substrate integrity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If different paste formulations are used on each side of bipole electrodes, then performance is optimized, but it is difficult to formulate a paste that meets conflicting requirements

Engineering Contradiction:
Improvebattery performanceVSAvoidpaste formulation complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies different paste formulations to different sides of the bipole electrode, with each formulation optimized for its specific side's requirements. The ultrasonic pasting process ensures that each localized paste formulation achieves intimate contact with the electrode substrate, thereby optimizing performance for each side while managing the complexity of having multiple formulations.

Inventive Principle:
Principle #3Local quality

4Manufacturing precision

If paste is applied directly to the electrode substrate, then better contact is achieved, but voids and gaps still occur during the pasting process

Engineering Contradiction:
Improvepaste-substrate contact qualityVSAvoidvoids and gaps
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent applies ultrasonic vibration during the direct pasting process to eliminate voids and gaps that would otherwise form. The vibration causes the paste to flow and conform to the electrode substrate surface, ensuring complete contact and eliminating harmful voids while maintaining the simplicity of direct paste application.

Inventive Principle:
Principle #18Mechanical vibration

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The process enhances cycle life, reduces internal resistance, improves active material utilization, and increases energy density by ensuring intimate contact and optimized paste formulation, particularly through layered pastes for monopole and bipole electrodes.

Implementation Method 1

an ultrasonic system provides ultrasonic energy and mechanical pressure to the assembly

Methodology Applied
Scientific EffectUltrasonic energy: Ultrasound

Implementation Method 2

an ultrasonic system provides ultrasonic energy and mechanical pressure to the assembly

Methodology Applied
Scientific EffectMechanical pressure: Compression

Data Source

PatentUS12469840B2Methods and apparatuses for paste production and application on electrode substrates for lead acid batteries
Publication Date: 2025.11.11 GRIDTENTIAL ENERGY INC
  • US12469840B2 patent drawing
  • US12469840B2 patent drawing
  • US12469840B2 patent drawing

AI summary

A system to create a cell for a monopole or bipole lead acid battery includes a paster to produce wet paste, a first carrier structure to receive the wet paste, and a second carrier structure to receive an electrode substrate. A combining station combines the first carrier structure and corresponding wet paste and the second carrier structure and corresponding electrode substrate into an assembly. An ultrasonic welding system receives the assembly and provides mechanical pressure and ultrasonic energy to the assembly. A removal station via which to remove at least one of the first and second carrier structures to create a modified assembly.