Thin Film Lead Conductor Surface Area Expansion
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Solution Overview
Problem
High-frequency signal currents in thin-film devices lead to increased loss and heat generation due to the skin effect, which is challenging to mitigate in miniaturized devices where conventional methods to increase the sectional area of lead conductor films are not feasible.
Innovation Solution
Incorporating an insulating material to increase the surface area of the lead conductor film, either by embedding insulating materials within the conductor film or forming parallel shunts, allowing high-frequency currents to distribute widely and reduce current density, thereby minimizing loss and heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the signal frequency is increased for higher speed and performance, then the processing speed and performance improve, but loss and heat generation due to the skin effect increase
Solution Approach 1:
The patent increases the surface area of the lead conductor film by creating a three-dimensional structure with increased surface area portions. Instead of simply increasing the cross-sectional area in one dimension, the invention uses dimensional transformation by embedding insulating materials to create a conductor structure with extended surface area, allowing high-frequency currents to distribute over a larger surface and reducing skin effect-related losses.
2Loss of energy
If the sectional area of the lead conductor film is increased to reduce skin effect, then loss and heat generation decrease, but device miniaturization becomes difficult
Solution Approach 1:
The patent applies local quality by creating increased surface area portions at specific locations along the lead conductor film rather than uniformly increasing the cross-sectional area throughout. Insulating materials are embedded at selected positions to locally expand the conductor surface area, reducing skin effect losses only where needed while maintaining overall device miniaturization.
3Volume of moving object
If the lead conductor film is miniaturized for device miniaturization, then device size decreases, but surface area for heat radiation decreases
Solution Approach 1:
The patent resolves this contradiction by transforming the conductor structure into a three-dimensional form with increased surface area portions. By embedding insulating materials within or adjacent to the lead conductor film, the invention creates a structure that maintains a small footprint while providing extended surface area for heat radiation, effectively decoupling device size from heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces loss and heat generation in thin-film devices, including magnetic heads and recording/reproducing apparatus, even in fine-patterned designs, by distributing high-frequency currents over an enlarged surface area, thus addressing the skin effect without increasing the sectional area of the conductor film.
Implementation Method 1
the ensuing increase in loss and heat generation due to the skin effect that a signal current flows at the surface of a lead conductor film in a concentrated manner
Data Source
AI summary
The present invention relates to a thin-film device including a thin-film element and a lead conductor film. The thin-film element and the lead conductor film are embedded in an insulating film. The lead conductor film has a terminal area at one end thereof, is connected to the thin-film element at the other end thereof, and between the one end and the other end, has an increased surface area portion whose volume is partially occupied by an insulating material to increase surface area. As a result, there is provided a high frequency thin-film device capable of reducing loss and heat generation due to skin effect, particularly a thin-film magnetic head.