Diffusion-Bonded Lead Connector for Closer Hermetic Contact Spacing
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Solution Overview
Problem
Existing implantable active medical devices face challenges in reducing size and cost due to complex and expensive manufacturing processes, particularly in the design of hermetic lead connectors that require multiple interconnects and high-temperature brazing.
Innovation Solution
The use of diffusion bonding to create hermetic lead connectors with electrically conducting and insulating rings, forming a solid-state bond that reduces manufacturing temperatures and eliminates the need for gold or metal brazing, allowing for closer contact spacing and a more compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional brazing processes are used to join lead connector components, then strong bonds are achieved, but manufacturing temperature increases and device size increases
Solution Approach 1:
The patent changes the bonding parameter from high-temperature brazing to low-temperature diffusion bonding. This involves modifying the bonding process parameters (temperature, time, pressure) to achieve strong bonds at lower temperatures, directly resolving the contradiction between bond strength and manufacturing temperature.
Solution Approach 2:
The patent replaces the traditional brazing mechanism (which relies on filler metal and high temperature) with a diffusion bonding mechanism that operates at lower temperatures through atomic diffusion. This substitution of the bonding mechanism allows achieving strong bonds without the high temperatures required by brazing.
2Reliability
If traditional lead connector designs with multiple interconnects are used, then reliable electrical connections are achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges multiple separate interconnect components into a single integrated lead connector structure. By combining the electrical connection functions into one unified component with fewer discrete interconnects, the patent reduces device complexity and manufacturing cost while maintaining reliable electrical connections through the integrated design.
Solution Approach 2:
The patent creates a universal lead connector structure that performs multiple electrical connection functions through a single integrated design. This multi-functional approach eliminates the need for multiple specialized interconnects, reducing complexity while maintaining the reliability of all electrical connections through the unified structure.
3Reliability
If conventional manufacturing processes are used, then adequate sealing is achieved, but the number of parts and manufacturing steps increases
Solution Approach 1:
The patent combines the hermetic sealing function with the lead connector structure itself, rather than using separate sealing components. This integration of sealing into the connector body reduces the number of parts while maintaining adequate hermetic sealing through the unified structure design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the size and manufacturing temperature of hermetic lead connectors, decreases the number of parts and connections, and enhances process control, resulting in a more efficient and cost-effective implantable medical device.
Implementation Method 1
The interface bond on an atomic level can be a solid state diffusion bond (i.e., diffusion bond) that forms a hermetic bond with the electrically insulating portions and electrically conducting contact portions of the hermetic lead connectors
Data Source
AI summary
A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.