Lead Connector Protrusion Layout for Stable Solder Reflow
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Solution Overview
Problem
The solder in the semiconductor assembly process can move during reflow, causing displacement of the semiconductor chip from the leads or connectors, leading to potential misalignment and reliability issues.
Innovation Solution
A semiconductor device design featuring conductive members with protruded portions and connecting members, such as solder, that are strategically positioned to minimize displacement by utilizing surface tension and forming fillets during reflow, ensuring stable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is supplied between the leads and the semiconductor chip for connection, then electrical connection is achieved, but the solder may move during reflow causing displacement of the semiconductor chip from the leads
Solution Approach 1:
The lead connector is divided into multiple segments including a body portion and multiple protruding portions. Each protruding portion can independently interact with the solder, distributing the solder's movement forces across multiple contact points rather than a single continuous structure, thereby preventing displacement of the semiconductor chip.
Solution Approach 2:
The protruding portions act as intermediary elements between the solder and the lead connector body. These protrusions provide additional surface area and contact points that mediate the interaction between the flowing solder and the rigid connector structure, allowing the solder to be contained and guided during reflow without transferring excessive movement to the semiconductor chip.
2Reliability
If connectors are connected to the semiconductor chip using solder reflow, then electrical connection is established, but the connectors may be displaced from the semiconductor chip
Solution Approach 1:
The connector structure is segmented into a body portion and multiple protruding portions that extend toward the solder joints. This segmentation allows each protruding portion to independently engage with the solder, providing localized anchoring points that prevent overall connector displacement during the reflow process.
Solution Approach 2:
The protruding portions are pre-positioned to extend toward the expected location of the solder joints before reflow occurs. This preliminary positioning ensures that when the solder is applied and heated, the protrusions are already in place to guide and contain the solder flow, preventing connector displacement before the connection is finalized.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses positional misalignment and enhances reliability by maintaining the integrity of electrical connections between the semiconductor chip and the conductive members and connectors, reducing the risk of short circuits.
Implementation Method 1
utilizing surface tension and forming fillets during reflow
Data Source
AI summary
A device includes a first conductive-member which connects to a first electrode on a first face of a chip. A second conductive-member is spaced from the chip and the first conductive-member. A third conductive-member is spaced from the first and second conductive-members. A first connector connects between the second electrode and the second conductive-member. A second connector is opposed to a third electrode on the second face and connects the third electrode and the third conductive-member. A first connecting-member connects the first connector and the second face. A second connecting-member connects the first connector and the second conductive-member. The first connector includes first protruded portions protruded in a first direction from the first conductive-member to the second conductive-member. The second connecting-member is provided to correspond to each of places between the first protruded portions and the second conductive-member.