Lead Extender Bonding for More Wire Connections in IC Packages
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Solution Overview
Problem
Semiconductor device manufacturing processes often prioritize cost reduction over performance and reliability, leading to suboptimal performance and reliability in high-volume production, particularly in extending wire bonding areas without increasing package size or dimensions.
Innovation Solution
A semiconductor device with conductive lead extenders affixed to neighboring leads using a conductive adhesive, allowing for extended wire bonding areas without increasing package size, especially useful for power leads requiring multiple connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the package size is increased to accommodate extended wire bonding areas, then wire bonding capabilities are improved, but package dimensions increase
Solution Approach 1:
The patent applies dimensionality change by extending the wire bonding area vertically through lead extenders that protrude from the package surface, rather than horizontally expanding the package footprint. This allows multiple wire bonds to be formed on extended leads without increasing the overall package dimensions, effectively moving the bonding area into a third dimension.
Solution Approach 2:
The patent segments the wire bonding process by creating distinct bonding regions on different leads. Lead extenders are selectively formed on specific leads (e.g., power leads) that require multiple connections, while other leads maintain their original configuration. This segmentation allows extended wire bonding capabilities only where needed, without unnecessarily increasing package size.
2Ease of manufacture
If manufacturing processes are optimized for cost reduction, then product cost decreases, but performance and reliability deteriorate
Solution Approach 1:
The patent applies local quality by selectively forming lead extenders only on specific leads (such as power leads) that require multiple wire bond connections, rather than uniformly modifying all leads. This localized approach enhances reliability only where needed while minimizing additional manufacturing complexity and cost.
Solution Approach 2:
The patent implements partial action by applying the lead extender modification to only those leads that require extended wire bonding capabilities. This partial modification achieves the necessary performance improvement without the full cost and complexity of modifying the entire lead structure, optimizing the balance between reliability enhancement and manufacturing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances wire bonding capabilities without increasing package size, improving performance and reliability by enabling additional connections on power leads without altering the device's dimensions.
Implementation Method 1
The lead extender is affixed by way of a conductive adhesive and configured for extending the wire bonding area
Data Source
AI summary
A method of manufacturing a semiconductor device is provided. The method includes attaching a first end of a first bond wire to a first conductive lead and a second end of the first bond wire to a first bond pad of a first semiconductor die. A conductive lead extender is affixed to the first conductive lead by way of a conductive adhesive, the lead extender overlapping the first end of the first bond wire. A first end of a second bond wire is attached to the lead extender, the first end of the second bond wire conductively connected to the first end of the first bond wire.