Lead Frame Extended Portion for Stable Wedge Bonding Near Die Pads
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Solution Overview
Problem
Conventional semiconductor devices using lead frames face challenges in reliably bonding connection members due to potential shaking or deformation of the bonding portion during the wedge bonding process.
Innovation Solution
The electronic device design includes a lead frame configuration with a first lead and a second lead spaced apart from the die pad, where the first lead has a pad portion and an extended portion that extends between the die pad and the second lead, allowing for stable bonding of connection members by ensuring a region for pressing down with clamp members, thereby preventing deformation and ensuring suitable bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wedge bonding is performed by applying pressure and vibration to the bonding portion, then the connection member can be bonded to the target, but the bonding portion shakes or deforms making bonding difficult
Solution Approach 1:
The lead is pre-formed with an extended portion that protrudes toward the die pad before bonding occurs. This extended portion serves as a preliminary structural element that clamp members can press down on during bonding, stabilizing the lead before the actual bonding process begins and preventing deformation during vibration application.
Solution Approach 2:
The extended portion of the lead acts as an intermediary element between the clamp members and the bonding portion. By pressing down on the extended portion rather than directly on the bonding portion, the clamp members stabilize the lead structure without interfering with the bonding process, mediating between the need for stability and the need for bonding reliability.
2Volume of moving object
If the lead is positioned close to the die pad for compact design, then device size is reduced, but the lead may deform during bonding process
Solution Approach 1:
The lead is segmented into distinct functional portions: a bonding portion for connecting the connection member and an extended portion for structural support. This segmentation allows the extended portion to provide mechanical stability while the bonding portion performs its bonding function, enabling compact positioning near the die pad without sacrificing structural integrity.
Solution Approach 2:
Different portions of the lead have different structural qualities optimized for their specific functions. The extended portion has increased length and structural rigidity for stability, while the bonding portion has the necessary flexibility and surface area for bonding. This local differentiation of properties allows the lead to meet both compact size and structural stability requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables reliable bonding of connection members, preventing deformation and ensuring stable electrical connections, which enhances the manufacturing process and device performance.
Implementation Method 1
The wire is bonded to the bonding portion through wedge bonding. In wedge bonding, pressure and vibration are applied to the end portions of the wire.
Data Source
AI summary
An electronic device includes an electronic component provided with a first electrode pad, a die pad including an obverse surface facing in a first direction with the electronic component mounted on the obverse surface, a first lead, a second lead, and a first connection member electrically connecting the first electrode pad and the first lead to each other. The first lead and the second lead are disposed, as viewed in the first direction, on a same side of the die pad in a second direction perpendicular to the first direction. The first lead includes a first pad portion and a first extended portion. The first connection member is bonded to the first pad portion. The first extended portion extends from the first pad portion up to a position located between the die pad and the second lead as viewed in the first direction.