Lead Frame Extension Geometry for High-Speed Wire Bonding
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Solution Overview
Problem
Traditional wire bonding technologies face challenges in providing high-speed signal transmission due to uncontrollable electrical characteristics, leading to signal attenuation and increased costs.
Innovation Solution
The design of integrated circuit lead frames with extension portions on leads that connect towards each other for wire bonding, optimizing wire spacing to achieve impedance matching, thereby enhancing signal transmission speed and reducing process costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional wire bonding packaging technology is used, then process cost is reduced, but signal transmission speed and impedance control capability deteriorate
Solution Approach 1:
The lead structure is designed with different sections having different functions: the extension portion provides localized impedance control and spacing adjustment, while the body portion maintains structural integrity. This local differentiation allows traditional wire bonding to achieve high-speed signal transmission capabilities without requiring complete adoption of expensive alternative packaging technologies.
2Quantity of substance
If wire spacing is reduced for high-density packaging, then packaging density is improved, but impedance matching control becomes difficult
Solution Approach 1:
The lead extension portions are pre-configured with specific geometries and spacing during the lead frame manufacturing process, before wire bonding occurs. This preliminary structuring establishes controlled impedance pathways that maintain signal integrity even when wires are closely spaced, eliminating the need for post-manufacturing impedance adjustments.
Solution Approach 2:
The lead extension portions modify the electrical parameters (impedance, capacitance, inductance) of the signal path by changing the physical geometry and spacing. This allows the system to maintain optimal impedance matching for high-speed signals while achieving high-density wire placement, effectively decoupling the trade-off between density and impedance control.
Data Source
AI summary
An integrated circuit lead frame and a semiconductor device thereof are provided. The integrated circuit lead frame includes a die pad and a plurality of leads. The die pad is provided to attach a die. The plurality of leads are provided for connection to the die through wire bonding. The leads include a pair of a first lead and a second lead. The first lead includes a first body and a first extension portion connected to the first body. The second lead includes a second body and a second extension portion connected to the second body. The first extension portion and the second extension portion extend in directions toward each other.