Lead Foreign Matter Detection in Component Mounting Imaging
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Solution Overview
Problem
Existing electronic component mounting devices fail to detect burrs or foreign matters adhering to leads of lead components before mounting, which can cause adherence to the board during assembly.
Innovation Solution
A method and device that utilize a part camera to irradiate the lead with light, capture an image, and process it to detect foreign matters by analyzing brightness changes within a specified detection range relative to the lead position, excluding the lead's occupied region, and comparing brightness against a threshold value.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional image processing is used to detect foreign matters on leads, then the detection capability is insufficient, but implementing advanced detection increases processing complexity
Solution Approach 1:
The image processing is segmented into distinct functional modules: lead position detection module that identifies lead coordinates, detection range setting module that defines the inspection area around the lead, and foreign matter detection module that analyzes brightness in the defined range. This segmentation allows each module to perform a specific task efficiently, improving foreign matter detection capability while keeping the overall system manageable through modular design.
Solution Approach 2:
The system performs preliminary actions by first detecting the lead position and pre-setting the detection range before conducting foreign matter detection. The lead position is detected first, then the detection range is automatically set based on the lead's location and orientation, and only then is the foreign matter detection performed. This preliminary preparation reduces the complexity of the main detection task by pre-defining the inspection area.
2Reliability
If the entire image area is processed for foreign matter detection, then detection coverage is maximized, but processing time and computational load increase
Solution Approach 1:
The system applies local quality by setting the detection range specifically around the lead region rather than processing the entire image. The detection range is determined based on the lead's position, length, and orientation, creating a localized inspection area that focuses computational resources only where foreign matters are likely to be found. This maintains high detection coverage for relevant areas while significantly reducing processing time by excluding irrelevant image regions.
Solution Approach 2:
The system extracts and isolates the lead region from the entire image by detecting lead coordinates and defining a specific detection range around the lead. This extraction creates a focused inspection area that contains only the relevant portion of the image, allowing the system to achieve comprehensive detection coverage for foreign matters on leads while minimizing processing time by excluding the rest of the image from analysis.
3Measurement precision
If lead region is included in detection range, then all potential foreign matters are detected, but false detections from lead reflections increase
Solution Approach 1:
The system applies asymmetry by creating an offset detection range that is positioned adjacent to the lead rather than symmetrically including it. The detection range is set with a specific distance offset from the lead center, creating an asymmetric inspection zone that focuses on areas where foreign matters are likely to exist (near the lead but not on it). This asymmetric positioning maintains detection sensitivity while avoiding the high-reflection lead region that causes false detections.
Solution Approach 2:
The system converts the harmful effect of lead reflections into a beneficial feature by using the lead's position and orientation information to define the detection range boundaries. The lead's own geometric properties (length, orientation) are used to strategically position the detection range such that it benefits from the lead's presence as a reference for accurate foreign matter detection while avoiding the reflective interference. The lead's characteristics become the basis for creating an optimized detection zone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively detects foreign matters adhering to leads, preventing their adherence to the board by accurately identifying and excluding regions with high brightness corresponding to foreign matter reflections, reducing processing load and ensuring precise mounting.
Implementation Method 1
an irradiation section that irradiates a lead portion including a tip end of the lead with light
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
An object is to provide a foreign matter detection method and an electronic component mounting device capable of detecting a foreign matter adhered to a lead of a lead component. A lead portion including a tip end of a lead of a radial component is irradiated with light from a side, and is imaged from below. A position of the lead is specified based on a captured image data. A detection range based on a through hole to be mounted is set based on the specified position of the lead. The captured image becomes an image with high brightness of the portion of the foreign matter. Therefore, the foreign matter is detected based on the change in brightness in the detection range.