Lead Frame Alignment for Hybrid Circuit Manufacturing
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Solution Overview
Problem
The existing method of manufacturing hybrid integrated circuit devices is cumbersome and costly due to the troublesome positioning and fixing of leads to pads on the substrate, requiring precise alignment and mechanical support, which increases manufacturing expenses.
Innovation Solution
A method involving a substrate with multiple circuit boards and a lead frame where the lead frame is superposed on the substrate, using alignment pins to align the leads with pads, and then separating the circuit boards from the substrate after fixing the leads, simplifying the alignment process and eliminating the need for individual lead alignment and mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If leads are individually positioned and fixed to pads using solder and reflow furnace, then reliable electrical connection is achieved, but positioning becomes troublesome and manufacturing cost increases
Solution Approach 1:
Multiple leads are merged into a single lead frame structure, allowing collective positioning and fixation. The lead frame integrates multiple leads with their respective pads on a single substrate, enabling simultaneous soldering and fixation of all leads in one reflow furnace operation, thereby eliminating individual positioning troubles while maintaining reliable electrical connections.
Solution Approach 2:
The lead frame is prepared in advance with all leads pre-positioned and pre-fixed to the substrate before the final soldering process. This preliminary positioning and fixation eliminates the need for individual lead alignment during the soldering process, reducing manufacturing complexity while ensuring reliable electrical connections.
2Ease of manufacture
If lead frame is used to collectively position leads, then positioning is facilitated, but lead frame itself requires positioning to substrate increasing cost
Solution Approach 1:
The lead frame is merged with the substrate into a single integrated structure. The substrate serves as both the mounting platform for circuit elements and the base for the lead frame, eliminating the need for separate positioning mechanisms. This integration simplifies the overall device structure while maintaining ease of lead positioning.
3Ease of manufacture
If multiple circuit boards are manufactured separately, then individual processing is simple, but overall productivity decreases
Solution Approach 1:
Multiple circuit boards are merged into a single substrate structure, allowing simultaneous processing of multiple boards. Circuit elements, conductive patterns, and lead frames can be manufactured and assembled on the substrate in bulk, then the substrate is divided into individual circuit boards after completion, thereby increasing productivity while maintaining processing simplicity.
Solution Approach 2:
The substrate is divided into multiple circuit board sections after bulk processing. This segmentation approach allows all processing steps to be performed on the entire substrate simultaneously for efficiency, then the finished substrate is divided into individual circuit boards, combining the benefits of bulk manufacturing with individual product delivery.
Data Source
AI summary
The method of the present invention includes a first step of preparing a substrate in which a plurality of circuit boards are integrally connected to one another, each of the circuit boards having conductive patterns which include pads formed on a surface of the circuit board; a second step of electrically connecting circuit elements to the respective conductive patterns on each of the circuit boards; a third step of positioning ends of leads above the respective pads by superposing a lead frame including the plurality of leads on the substrate, and fixing the leads to the pads; and a fourth step of separating the circuit boards from the substrate in a state where the leads are fixed to the respective pads on each of the circuit boards, and thus separating the leads from the lead frame.