Lead Frame Anchored Bars for Cooler Semiconductor Power Modules
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Solution Overview
Problem
Conventional semiconductor power modules face challenges in improving thermal performance, particularly in high power density applications, leading to excessive temperature increases under typical and heavy loads.
Innovation Solution
The introduction of a lead frame anchored bar design that includes a first and second lead frame anchored bar attached to anchor pads on a substrate, along with a single or dual control IC configuration, to enhance thermal management and reduce module length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional power module design is used, then the module structure is simple, but the thermal performance is poor leading to excessive temperature rise
Solution Approach 1:
The lead frame is segmented into multiple functional bars including anchored bars, leads, and tabs that are spatially separated and independently configured. This segmentation allows each component to perform specific thermal and electrical functions, improving heat dissipation efficiency while maintaining structural organization
Solution Approach 2:
The anchored bars extend in multiple spatial dimensions from the substrate, creating a three-dimensional thermal management structure. This dimensional expansion allows heat to be conducted away from the substrate in multiple directions, significantly improving thermal performance without increasing planar footprint
2Power
If power module operates under heavy load, then higher power output is achieved, but temperature increases excessively reaching 130°C
Solution Approach 1:
The anchored bars serve as thermal intermediaries between the substrate and the external environment. These bars conduct heat away from the substrate efficiently, acting as a mediator that transfers thermal energy from the high-power switching devices to the surrounding cooling structures, enabling sustained high power operation without excessive temperature rise
3Adaptability or versatility
If dual control IC configuration is used, then control capability is improved, but device complexity increases
Solution Approach 1:
The lead frame structure is designed with universal anchored bars that can accommodate either single or dual control IC configurations. The same basic anchored bar structure serves multiple functions: providing mechanical support, establishing electrical connections, and managing thermal dissipation regardless of whether one or two control ICs are used, thereby improving adaptability without proportionally increasing complexity
Data Source
AI summary
A power module includes a lead frame, a substrate mounted on the lead frame, a first anchor pad, a second anchor pad, a plurality of die pads, and a plurality of transistor dies. The lead frame includes a first lead frame anchored bar attached to the first anchor pad, and a second lead frame anchored bar attached to the second anchor pad. The power module may include a single control IC or two or more control ICs. For the case including a single control IC, the singe control IC controls a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, and a sixth transistor. For the case including two control ICs, a low voltage IC controls a first transistor, a second transistor, and a third transistor and the high voltage IC controls a fourth transistor, a fifth transistor, and a sixth transistor.