Lead Frame Conductive Posts for 3D Antenna Package Connection
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Solution Overview
Problem
Conventional wireless communication devices face challenges in miniaturization and electrical connectivity due to the need for 5G antenna placement near the housing of portable electronic products, limiting space and requiring innovative solutions for signal strength enhancement.
Innovation Solution
The electronic package incorporates a carrier structure with an antenna function, an electronic element, a lead frame with conductive posts, and an encapsulant with distinct encapsulating portions, allowing the conductive posts to be exposed for electrical connection, thereby enabling flexible antenna placement and connectivity to the mainboard.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the antenna element is disposed near the housing to enhance signal strength, then the wireless communication performance is improved, but the available space for the antenna element is limited and the device miniaturization is compromised
Solution Approach 1:
The patent transitions from planar antenna布局 to three-dimensional立体布局 by utilizing the Z-axis direction. The antenna element is positioned near the housing while connecting to the mainboard through vertical conductive posts, effectively using the third dimension to resolve the space conflict between signal strength requirements and device miniaturization.
Solution Approach 2:
The lead frame with conductive posts serves as an intermediary component between the antenna element and the mainboard. This intermediary structure enables electrical connection while allowing the antenna to be positioned optimally near the housing for signal strength, thus mediating between the conflicting requirements of space utilization and communication performance.
2Reliability
If the antenna element is disposed near the housing, then signal strength is enhanced, but establishing electrical communication with components in the center becomes difficult
Solution Approach 1:
The electrical connection path is segmented into multiple independent conductive posts rather than requiring a single complex trace. This segmentation simplifies the connection structure by using discrete vertical posts that independently bridge the antenna element and mainboard, reducing the complexity of establishing electrical communication.
Solution Approach 2:
The patent introduces vertical conductive posts in the Z-axis direction to establish electrical connection, moving from traditional planar PCB traces to three-dimensional vertical connections. This dimensional change simplifies the electrical communication path between the antenna near the housing and the mainboard in the center.
3Reliability
If the encapsulant completely encapsulates the lead frame, then protection is improved, but the conductive posts cannot be exposed for electrical connection
Solution Approach 1:
The encapsulant is designed with non-uniform distribution: it completely encapsulates the antenna element and most of the lead frame for protection, but deliberately leaves the conductive posts exposed at the top surface. This local quality differentiation simultaneously achieves component protection and electrical connection accessibility.
Solution Approach 2:
Instead of complete encapsulation, the patent applies partial encapsulation where the encapsulant covers the antenna element and lead frame body but stops before covering the conductive posts. This partial action maintains the necessary electrical connection accessibility while providing sufficient protection to the enclosed components.
Data Source
AI summary
An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.