Lead Frame Bending for Upper Surface Electrode Terminals
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Solution Overview
Problem
Existing manufacturing methods for semiconductor devices with electrode terminals on the upper surface face inefficiencies in producing multiple devices from a single lead frame, leading to decreased production efficiency.
Innovation Solution
A method involving a lead frame with circuit patterns, tie bars, and a frame portion that allows for collective manufacturing of semiconductor devices by bonding semiconductor elements, wire bonding, bending electrode terminals to extend on the upper surface, resin sealing, and subsequent cutting to separate individual devices, while maintaining the framework for efficient conveyance and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If electrode terminals are arranged to extend on the upper surface of the semiconductor element, then the arrangement area on the printed board is reduced, but the production efficiency deteriorates because multiple semiconductor devices cannot be manufactured collectively from a single lead frame
Solution Approach 1:
The lead frame is divided into multiple independent circuit patterns, each capable of forming a separate semiconductor device. The circuit patterns are arranged in a band shape with partition frames between them, allowing individual processing and separation while maintaining collective manufacturing efficiency
Solution Approach 2:
The lead frame structure serves multiple functions: it provides the circuit patterns for electrical connections, acts as a support structure during manufacturing, enables collective processing of multiple devices, and facilitates the formation of electrode terminals that extend upward. This multi-functionality allows simultaneous manufacturing of multiple devices from a single lead frame
2Productivity
If multiple semiconductor devices are manufactured collectively from a single lead frame, then production efficiency is improved, but the complexity of the lead frame structure and processing steps increases
Solution Approach 1:
The lead frame is segmented into multiple circuit patterns with partition frames, allowing each device to be independently configured while maintaining a unified structure for collective manufacturing
Solution Approach 2:
The lead frame is pre-configured with circuit patterns, tie bars, and frame portions in specific arrangements before the manufacturing process begins. This preliminary structuring enables subsequent processing steps to be performed efficiently on multiple devices simultaneously without requiring complex real-time adjustments
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances production efficiency by enabling the simultaneous manufacturing of multiple semiconductor devices with electrode terminals on the upper surface from a single lead frame, reducing arrangement area and improving processing efficiency from the lead forming to resin sealing steps.
Implementation Method 1
a die bonding step of bonding a semiconductor element to a die pad of a lead frame
Implementation Method 2
a wire bonding step of electrically connecting the semiconductor element and the plurality of electrode terminals by a metal wire
Implementation Method 3
a resin sealing step of sealing the lead frame with a resin so that a part of the electrode terminal portion and the tie bar are exposed
Data Source
AI summary
A lead frame includes a plurality of circuit patterns which each have a die pad and an electrode terminal portion and are disposed in a band shape, a tie bar, a frame portion and a suspension lead. Cut are a connection portion between electrode terminals and the frame portion, a connection portion between the frame portion and the tie bar at both end portions in a disposition direction of circuit patterns, and a connection portion from a connection part of the frame portion with the tie bar, between the circuit patterns to a part of the frame portion extending in the disposition direction. The electrode terminal portion is bent to extend to a direction of an upper surface of a semiconductor element. The lead frame is collectively resin-sealed while exposing the tie bar and the electrode terminal portion above the tie bar.