Lead Frame Bending Positioning to Prevent Resin Burr Drop
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Solution Overview
Problem
In semiconductor device manufacturing, resin burrs tend to drop during lead forming due to bending stress, leading to product malfunctions and reduced reliability, as existing methods do not consider the region where resin burrs occur.
Innovation Solution
A method involving sealing the inner lead with resin and bending a target region where stress is not applied to the resin burr, ensuring the resin burr does not crack or drop during the bending process by carefully positioning the bending axis to avoid the resin burr region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If lead forming (bending) is performed without consideration of resin burr region, then the bending process can be completed, but resin burrs drop due to bending stress causing product malfunctions and reliability issues
Solution Approach 1:
The patent identifies the resin burr generation region in advance through molding simulation or experimentation, and uses this information to determine the bending position beforehand. The bending axis is positioned such that the outer bending region does not overlap with the resin burr region, preventing burr drop before the bending operation is performed.
2Reliability
If bending is performed with high positioning accuracy requirements, then resin burr drop can be prevented, but the bending process becomes more complex and difficult to implement
Solution Approach 1:
The patent applies different requirements to different regions: the inner bending region can overlap with the resin burr region without problem, but the outer bending region must avoid the resin burr region. This localized quality approach allows bending to proceed with standard positioning accuracy while still preventing resin burr drop.
Data Source
AI summary
A method of manufacturing a semiconductor device includes a sealing step of sealing an inner lead of a lead frame with a resin, and a bending step of bending a target bending region in which a stress by bending is not applied to a resin burr generated in the sealing step.