Lead Frame with Bent Part for Semiconductor Package
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Solution Overview
Problem
Conventional semiconductor device packages face challenges with connection reliability due to uneven external terminal sizes, instability in stud bumps, high bending and thermal stress in L-shaped lead portions, and difficulties in resin encapsulation, leading to increased costs and manufacturing complexities.
Innovation Solution
A lead frame design with an outer frame, die pad, first and second connection terminals, and a bent part that connects them, allowing for adjustable external terminal heights and positions without a separation frame, reducing stress on cutting tools and preventing metal burrs, enabling easy manufacturing and cost reduction while maintaining reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a separation frame is formed to connect adjoining electronic component regions, then the structural integrity and securing of regions is improved, but the bending stress on cutting tools increases and metal burrs are generated
Solution Approach 1:
The invention removes the separation frame from the lead frame structure. By extracting this problematic component, the patent eliminates the source of bending stress on cutting tools and metal burr generation during separation, while maintaining electrical connectivity between regions through alternative means
2Ease of manufacture
If conventional lead frames with separation frames are used, then manufacturing process is standardized, but tool life is reduced due to increased stress on cutting tools
Solution Approach 1:
By removing the separation frame structure, the invention eliminates the rigid metal components that create high stress concentrations during cutting operations, thereby extending tool life while maintaining manufacturing feasibility through simplified processes
3Quantity of substance
If external terminals are formed on small areas with stud bumps, then connection density is increased, but connection reliability decreases due to uneven areas and unstable stud bumps
Solution Approach 1:
The invention applies different structural characteristics to different parts of the terminal structure. The lead frame portions providing external terminals are designed with optimized dimensions and positioning, creating locally adapted terminal structures that ensure both high connection density and reliable connections without requiring stud bumps on small areas
Data Source
AI summary
A lead frame of the present invention includes: a die pad on which a device is mounted; a first connection terminal which is provided around the die pad, and the lower surface of which serves as an external terminal; a second connection terminal which is provided around the die pad and electrically independent of the die pad, and the upper surface of which serves as an external terminal; a bent part provided between the first and the second connection terminals and connecting the first and the second connection terminals; and an outer frame. The bent part is bending-processed in a direction perpendicular to a face of the die pad. Within the outer frame, electronic component regions are formed adjoining each other and each including a die pad, and the first and the second connection terminals. The adjoining electronic components are connected through the first or the second connection terminal.