Lead Frame Coil Slit Structure for High-Frequency Surge Suppression
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Solution Overview
Problem
Existing semiconductor devices face challenges in protecting control ICs from high-frequency surges, which can cause latch-up failures due to inrush currents, and traditional protection methods either fail to suppress overcurrents or increase the size of the semiconductor module.
Innovation Solution
Incorporating a coil portion in the external connection wiring part of the semiconductor device, specifically in the lead frame, which features a plurality of slits and inter-slit regions arranged alternately, increasing the inductance and delaying the rise in current when a high-frequency surge is applied, thereby reducing the peak current and minimizing damage to the control ICs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional protection methods are used, then control ICs can be protected from surges, but the semiconductor module size increases
Solution Approach 1:
The patent combines the protection circuit function with the existing external connection wiring part (lead frame) by forming a coil portion within the wiring member itself. This integration merges two previously separate functions (wiring and protection) into a single component, achieving surge protection without increasing overall module size.
Solution Approach 2:
The external connection wiring part is designed to serve dual purposes: it acts as both the electrical connection pathway and the protection circuit element. The coil portion formed in the wiring member provides inductance for surge suppression while the wiring itself maintains its primary function of electrical connection, making the component universal and multi-functional.
2Reliability
If protection circuits are added, then reliability improves, but device complexity increases
Solution Approach 1:
The protection circuit functionality is merged into the existing wiring structure rather than being added as a separate component. The coil portion is formed directly in the external connection wiring part, combining the wiring and protection functions into a single integrated structure, thereby improving reliability without proportionally increasing device complexity.
3Reliability
If inductance is increased to suppress inrush current, then protection effectiveness improves, but the physical size of the coil increases
Solution Approach 1:
The patent applies local quality by concentrating the coil structure in a specific localized region within the external connection wiring part. The wiring member has different structural characteristics in different regions: a coil portion in the area where surge suppression is needed, and flat plate portions in other areas for optimal electrical connection. This localized application of coil structure achieves effective inrush current suppression without requiring the entire wiring area to be expanded.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of the coil portion effectively suppresses the inrush current caused by high-frequency surges, reducing the risk of damage to control ICs and enhancing the reliability of the semiconductor device without increasing its size.
Implementation Method 1
Incorporating a coil portion in the external connection wiring part of the semiconductor device, specifically in the lead frame, which features a plurality of slits and inter-slit regions arranged alternately, increasing the inductance and delaying the rise in current when a high-frequency surge is applied
Data Source
AI summary
A semiconductor device, including a wiring member having a coil portion. The coil portion includes: a plurality of first slits and a plurality of second slits arranged alternately in a first direction, each first slit extending from a first side of the wiring member in a second direction, and each second slit extending from a second side of the wiring member in a direction opposite to the second direction, a plurality of first inter-slit regions each between one of the first slits and one of the second slits adjacent thereto in the first direction, and a plurality of second inter-slit regions each between one of the second slits and one of the first slits adjacent thereto in the first direction. The first and second inter-slit regions have first peak portions and second peak portions at center portions thereof, on opposite sides of a principal surface of the wiring member.