Lead Frame Conductive Posts for Flexible 5G Antenna Packaging
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Solution Overview
Problem
Conventional wireless communication devices face challenges in miniaturization and electrical connectivity due to the need for 5G antenna placement near the housing, limiting space and requiring innovative solutions for signal strength enhancement.
Innovation Solution
An electronic package is designed with a carrier structure having an antenna function, an electronic element, a lead frame with conductive posts, and an encapsulant with distinct encapsulating portions. The encapsulant is formed to expose the conductive posts, allowing for direct or indirect integration of a connector, which enables flexible electrical connection to the mainboard.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the antenna element is disposed near the housing to enhance signal strength, then the wireless signal reception quality is improved, but the available space for other components is reduced and device miniaturization becomes difficult
Solution Approach 1:
The patent combines the antenna element, electronic elements, and connector into a single integrated carrier structure. The antenna element is formed on the carrier structure, and electronic elements are mounted on the same carrier, merging multiple components that were traditionally separate into one unified structure, thereby saving space while maintaining antenna performance
Solution Approach 2:
The carrier structure serves multiple functions simultaneously: it acts as the substrate for the antenna element, provides mounting for electronic elements, and incorporates integrated connectors for electrical connection. This multi-functional design eliminates the need for separate structures for each function, resolving the space constraint
2Reliability
If the antenna element is disposed near the housing for optimal signal strength, then the wireless communication performance is improved, but the electrical connection to the mainboard becomes more complex
Solution Approach 1:
The connector is integrated directly into the carrier structure, merging the connection function with the antenna substrate. This integration eliminates the need for separate connection mechanisms and reduces the complexity of electrical connections between the antenna element and the mainboard
Solution Approach 2:
The carrier structure acts as an intermediary that combines the antenna element, electronic elements, and connector into a single module. This intermediary structure simplifies the overall system by pre-integrating multiple components, making the electrical connection to the mainboard more straightforward
Data Source
AI summary
An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.