Lead Frame Connecting Element Design for Semiconductor Reliability
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Solution Overview
Problem
Circuit arrangements with lead frames face reliability issues due to shock-susceptible and aging bonded connections, which also occupy additional installation space, making them complex and inefficient.
Innovation Solution
A lead frame design incorporating an electrically conductive connecting element and an insulating element with a cylindrical cavity, where the connecting element is mechanically and electrically connected to the lead frame, providing a more stable and compact electrical connection through press-fit pins, reducing mechanical stress and installation space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonded connections are used to establish electrical connections outside the lead frame, then electrical connectivity is achieved, but reliability deteriorates due to shock susceptibility and material aging
Solution Approach 1:
The patent merges the electrical connection function directly into the lead frame structure by integrating connecting elements (PF) that extend from the lead frame surface. This eliminates the need for separate bonded connections outside the lead frame, combining the lead frame's mechanical support function with the electrical connection function into a single integrated structure, thereby improving reliability while reducing overall system complexity
Solution Approach 2:
The patent introduces insulating elements (IS) as intermediary components that mechanically connect the connecting elements (PF) to the lead frame (AR) while electrically insulating them. This intermediary structure provides stable mechanical anchoring and electrical isolation, preventing direct contact between conductive parts and reducing the risk of short circuits, thus enhancing connection reliability without adding significant complexity
2Reliability
If bonded connections are used for electrical connections, then electrical connectivity is established, but installation space increases due to additional connection components
Solution Approach 1:
The connecting elements (PF) are integrated directly into the lead frame structure, extending from the lead frame surface rather than being separate components. This merging of the connection structure into the existing lead frame footprint eliminates the need for additional space for separate bonded connections, thereby maintaining connection stability while reducing installation space
Solution Approach 2:
The insulating elements (IS) are positioned within the recesses (AS) of the lead frame, and the connecting elements (PF) are arranged within the insulating elements. This nested arrangement allows multiple functional components to occupy the same spatial envelope, effectively utilizing the lead frame's internal volume and reducing the overall installation footprint while maintaining stable mechanical and electrical connections
3Ease of manufacture
If traditional lead frame structures are used, then manufacturing is simple, but mechanical stress and vibrations cause connection failures
Solution Approach 1:
The patent employs composite construction by combining different material properties: the lead frame (AR) provides mechanical support and electrical conductivity, while the insulating elements (IS) provide electrical isolation and mechanical anchoring. This composite structure distributes mechanical stress across different material layers, improving vibration and shock resistance without complicating the manufacturing process, as the components can be produced separately and assembled through simple insertion into recesses
Data Source
AI summary
The present disclosure relates to semiconductor components. The teachings thereof may be embodied in a lead frame for a semiconductor component including: a frame having a recess; an electrically conductive connecting element for establishing an electrical connection to the semiconductor component arranged in the recess; and an insulating element arranged in the recess and mechanically connecting the connecting element to the frame and electrically insulating it from the frame.