Lead-Frame Voltage Converter Module Without External PCB
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Solution Overview
Problem
Integrating a passive component such as an inductor with a buck converter in a package while maintaining sufficient reliability is challenging, and existing solutions require an external printed circuit board (PCB) for electrical connections.
Innovation Solution
A voltage convertor module comprising a lead-frame, a unitary bare die, and a molding body, where the bare die is directly connected to the lead-frame electrodes, and the inductor is externally connected to the module, eliminating the need for an external PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If circuit units are not integrated in a bare die and external PCB is used for connections, then ease of manufacture is improved, but device complexity increases and reliability decreases
Solution Approach 1:
The patent integrates multiple circuit units (buck controller, switching units, feedback unit) and passive components (inductor) into a single bare die, eliminating the need for external PCB connections. This merging of previously separate components resolves the contradiction by achieving both manufacturing simplicity and reduced device complexity simultaneously.
Solution Approach 2:
The bare die is designed to perform multiple functions by integrating control circuitry, switching elements, and power conversion capabilities in one unit. This multi-functional integration allows the device to operate as a complete voltage converter without requiring additional external components or complex interconnections.
2Ease of manufacture
If circuit units are not integrated in a bare die and external PCB is used for connections, then ease of manufacture is improved, but reliability worsens
Solution Approach 1:
By combining all circuit units and passive components into a single integrated bare die, the patent eliminates multiple external connection points that would otherwise be potential failure sources. This integration maintains ease of manufacture while significantly improving reliability through reduced connection interfaces.
3Device complexity
If multiple circuit units are integrated in a bare die, then device complexity is reduced and reliability is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The bare die is segmented into distinct functional blocks (buck controller block, first switching unit block, second switching unit block, feedback unit block) with dedicated pads for each function. This segmentation allows for modular design and manufacturing while achieving high-level integration, balancing manufacturing precision requirements with device complexity reduction.
Solution Approach 2:
Different regions of the bare die are optimized for specific functions with appropriate pad configurations and circuit implementations. The input voltage pad, output voltage pad, switching pad, and controlling pad each have localized characteristics suited to their specific functions, enabling precise manufacturing while maintaining overall system simplicity.
Data Source
AI summary
A voltage convertor module includes a lead-frame, a unitary bare die and a molding body. The lead-frame can have a plurality of electrodes including an input voltage electrode, an output voltage electrode, a ground electrode and a controlling electrode. The unitary bare die is disposed only on the lead-frame, where a plurality of pads of the unitary bare die are electrically connected to the electrodes of the lead-frame correspondingly. The unitary bare die includes the plurality of pads, a buck controller block, a first switching unit block, a second switching unit block, a feedback unit block and a plurality of routing structures.