Semiconductor Lead Frame Layout for Balanced Current and Cooling
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Solution Overview
Problem
Existing semiconductor devices face challenges in improving the arrangement of lead frames for connecting semiconductor chips and wiring patterns, particularly in enhancing radiation performance and reducing heat generation and self-inductance imbalances.
Innovation Solution
The semiconductor device features a unique arrangement of lead frames with chip joining, wiring joining, and bridging portions, where the space between bridging portions is smaller than between chip and wiring joining portions, and includes a coolant cooling system with overlapping cooling fins to improve heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If lead frames are arranged with equal spacing between chip joining portions, then manufacturing is simplified, but current crowding and self-inductance imbalances occur
Solution Approach 1:
The patent applies asymmetry by positioning the bridging portion of the lead frame such that the space between bridging portions is smaller than the space between chip joining portions. This asymmetric arrangement balances the current paths, reducing self-inductance imbalances and current crowding effects while maintaining manufacturing feasibility.
2Area of stationary object
If lead frames are positioned closer together, then device area is reduced, but heat generation and self-inductance imbalances increase
Solution Approach 1:
The asymmetric positioning of the bridging portion optimizes the current path lengths between adjacent lead frames. By making the space between bridging portions smaller than the space between chip joining portions, the patent reduces self-inductance imbalances and heat generation while maintaining a compact device footprint.
3Temperature
If cooling fins are added to enhance cooling, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent merges the cooling function with the existing lead frame structure by integrating cooling fins into the lead frame assembly. This combination approach enhances heat dissipation capabilities while minimizing the increase in device complexity, as the cooling system is integrated rather than added as a separate subsystem.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces current crowding, heat generation, and self-inductance imbalances, while enhancing cooling efficiency and radiation performance by optimizing the layout and integration of cooling mechanisms.
Implementation Method 1
coolant cooling system with overlapping cooling fins to improve heat dissipation
Implementation Method 2
enhancing radiation performance by optimizing the layout and integration of cooling mechanisms
Data Source
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AI summary
Provided is a semiconductor device including: a circuit board; a wiring pattern; a first semiconductor chip and a second semiconductor chip that are provided above the circuit board and that are provided along a first direction in a plane parallel to a board surface; a first lead frame for electrically connecting the first semiconductor chip and the wiring pattern; and a second lead frame for electrically connecting the second semiconductor chip and the wiring pattern; wherein the first lead frame and the second lead frame each comprises: a chip joining portion provided above at least a part of the semiconductor chip; a wiring joining portion provided above at least a part of the wiring pattern; and a bridging portion for connecting the chip joining portion and the wiring joining portion; and in the first direction, a space between the bridging portion of the first lead frame and the bridging portion of the second lead frame is smaller than a space between the chip joining portion of the first lead frame and the chip joining portion of the second lead frame.