Lead Frame Grooves for Semiconductor Dicing Efficiency
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Solution Overview
Problem
Conventional semiconductor-device manufacturing methods require complex and costly steps for peeling off resin packages from lead frames and individually pasting them on dicing sheets, complicating the manufacturing process and increasing costs.
Innovation Solution
A lead frame with units arranged in a matrix pattern, featuring frame-shaped supporters with penetration grooves and half grooves at dividing lines, allowing for efficient separation and dicing of multiple circuit devices without the need for individual resin package separation and re-pasting, simplifying the manufacturing process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional resin molding method with sealing sheet is used, then resin packages can be formed, but complex peeling and re-pasting steps are required
Solution Approach 1:
The invention pre-forms the lead frame with integrated grooves and recesses that define unit boundaries before resin molding. This preliminary structuring allows the resin to be molded directly onto the lead frame without requiring subsequent peeling or re-pasting operations, as the separation features are already in place
Solution Approach 2:
The invention merges the lead frame structure with the resin package formation process by integrating the unit separation features directly into the lead frame. This combines what were previously separate operations (lead frame preparation, resin molding, and package separation) into a single integrated process
2Productivity
If multiple resin packages are formed on single lead frame, then productivity increases, but individual peeling and re-pasting is required
Solution Approach 1:
The lead frame is segmented into multiple units with clearly defined boundaries through grooves and recesses. This segmentation allows multiple resin packages to be formed simultaneously on a single lead frame while maintaining easy separability, thus improving productivity without increasing process complexity
Solution Approach 2:
The grooves and recesses act as intermediary features that facilitate the separation of multiple resin packages from the lead frame. These structural elements enable batch processing of multiple packages while providing built-in separation mechanisms that eliminate the need for individual handling
3Manufacturing precision
If dicing is performed after peeling resin packages, then individual devices are obtained, but additional handling steps are needed
Solution Approach 1:
The lead frame is pre-structured with grooves and recesses that define precise unit boundaries before dicing. This preliminary definition of separation lines ensures accurate device separation during dicing while eliminating time-consuming peeling and re-pasting handling steps
Data Source
AI summary
Provided are: a lead frame enabling efficient manufacturing of multiple circuit devices; and a method for manufacturing a circuit device using the same. In the lead frame of the present invention, units are arranged and frame-shaped first and second supporters are provided around the units to mechanically support the units. Moreover, a half groove is provided in the first supporter at a portion on an extended line of a dividing line defined at a boundary between each adjacent two of the units. Furthermore, a penetration groove penetrating a part of the second supporter at a portion on an extended line of another dividing line is provided.