Lead Frame Die Pad Layout for Multi-Chip Electrical Isolation
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Solution Overview
Problem
Semiconductor devices with multiple chips mounted side by side face the risk of electronic components coming into contact with each other, leading to potential electrical shorts and performance issues.
Innovation Solution
A semiconductor device design featuring a first lead with die pads and connecting portions arranged in specific configurations to prevent direct contact between semiconductor elements, using a conductive support member and sealing resin to isolate and secure elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor chips are mounted side by side on the same lead frame island, then the device can achieve higher integration and functionality, but the risk of electronic components coming into contact and causing electrical shorts increases
Solution Approach 1:
The lead frame is divided into multiple isolated islands, with each island serving as an independent mounting area for semiconductor chips. The islands are separated by insulating resin material, creating physical and electrical isolation between adjacent components. This segmentation allows multiple chips to be mounted on the same lead frame while preventing contact between them, thus maintaining both high integration and electrical isolation.
2Area of stationary object
If multiple electronic components are mounted densely on the same lead, then the device size can be reduced, but the manufacturing precision required to prevent contact increases
Solution Approach 1:
An insulating resin material is introduced as an intermediary between adjacent semiconductor chips and lead frame islands. This resin material fills the spaces between components, providing both mechanical support and electrical isolation. The intermediary resin eliminates the need for extremely precise component placement, as it compensates for positioning variations and prevents contact between adjacent components, thereby reducing the manufacturing precision requirements while maintaining compact device dimensions.
Data Source
AI summary
There is provided a semiconductor device including: a first lead; a first semiconductor element mounted on the first lead; and a sealing resin that covers the first semiconductor element, wherein the first lead includes a first die pad, a second die pad, a third die pad, a first connecting portion, and a second connecting portion, wherein the first die pad has a first main surface and a first back surface facing opposite sides in a thickness direction, and wherein the second die pad is arranged side by side with the first die pad in a first direction orthogonal to the thickness direction, and is located on a side of the first main surface with respect to the first die pad in the thickness direction.