Lead Frame Layout for Die Pad Position Stability
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Solution Overview
Problem
Existing electronic devices using lead frames face challenges in maintaining the reliability of the lead frame due to deformation, which can shift the position of the die pad, leading to improper mounting of electronic components.
Innovation Solution
The electronic device employs a lead frame configuration with multiple leads, including a first lead, a second lead, and a plurality of fourth leads, each with specific outer and inner portions, to enhance structural integrity and prevent deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a lead frame is used to mount electronic components, then the device structure is simplified and manufacturing is easier, but the lead frame deforms causing die pad position shifts
Solution Approach 1:
The lead frame is divided into multiple separate leads (first lead, second lead, third lead, fourth lead) instead of a single integrated structure. Each lead is independently formed and then connected to the die pad, allowing individual control and positioning of each lead to prevent deformation and maintain precise die pad positioning during manufacturing and assembly.
2Productivity
If the lead frame structure is simplified for easier manufacturing, then production efficiency increases, but the reliability of the lead frame decreases due to deformation
Solution Approach 1:
The lead frame is segmented into multiple independent leads that are formed separately and then connected to the die pad. This segmentation allows each lead to be precisely positioned and secured, preventing deformation while maintaining manufacturing efficiency through standardized formation and connection processes for each lead.
Solution Approach 2:
The leads are formed in advance as separate components before being connected to the die pad. This preliminary formation allows for precise positioning and preparation of each lead, ensuring that when they are connected to the die pad, the overall structure maintains high reliability and resistance to deformation.
3Ease of operation
If the die pad position is shifted due to lead frame deformation, then assembly becomes more difficult, but the electronic component cannot be properly mounted
Solution Approach 1:
By dividing the lead frame into multiple separate leads, each lead can be independently positioned and connected to the die pad at precise locations. This ensures that the die pad maintains its correct position and orientation, making assembly straightforward and ensuring proper mounting of electronic components without deformation-related issues.
Data Source
AI summary
An electronic device including a first electronic component, a sealing resin, and a first lead including an inner portion and an outer portion. The inner portion includes a die pad on which the first electronic component is mounted, and a connecting portion connecting the outer portion and the die pad. The outer portion is located on one side in a first direction, with respect to the die pad. The center of the outer portion is located on one side of the center of the die pad, in a second direction. As viewed in a thickness direction, the distance from a first end of a first cutting mark of the outer portion, in the first direction, to a first corner portion of the die pad, is 10.8 times or less, of a first length of the outer portion in the second direction.