Lead Frame Package Discharge Holes for Air Pressure Relief
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Solution Overview
Problem
Existing electronic sensor packages for vehicles face reliability issues due to air pressure build-up causing the cover to tilt or separate from the structure during assembly, exposing the sensor to harsh environments.
Innovation Solution
Incorporating discharge holes in specific leads and/or the die paddle of the lead frame package to allow air pressure relief within the cavity formed by the cover, reducing tilting, separation, and rotation of the cover.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a solid cover is used to seal the electronic sensor chip, then the sealing performance is improved, but the cover may become tilted or separate during assembly due to air pressure build-up
Solution Approach 1:
The patent applies the porous materials principle by incorporating discharge holes through specific leads of the lead frame. These holes create a controlled porous pathway that allows air pressure to escape during the molding process, preventing the cover from tilting or separating while maintaining the overall sealing integrity of the package.
Solution Approach 2:
The patent applies segmentation by dividing the solid cover structure into a covered portion and a lead frame portion with integrated discharge holes. This segmentation allows the lead frame to serve dual functions: electrical connection and pressure relief, resolving the contradiction between sealing and stability.
2Stability of the object's composition
If discharge holes are added to the lead frame, then the cover stability is improved, but the sealing performance may be compromised
Solution Approach 1:
The patent applies local quality by strategically positioning discharge holes only through specific leads rather than throughout the entire lead frame. This localized approach allows pressure relief at critical points while maintaining sealing integrity in other areas, resolving the contradiction between stability and sealing.
Solution Approach 2:
The discharge holes act as intermediaries that mediate between the internal cavity pressure and the external environment. By providing a controlled escape path for air pressure, they prevent cover instability while the cover itself maintains the primary sealing function, thus resolving the contradiction.
3Device complexity
If the cover is made as a single-piece solid structure, then the manufacturing complexity is reduced, but air pressure build-up causes assembly defects
Solution Approach 1:
The patent applies preliminary action by pre-forming discharge holes through specific leads during lead frame fabrication, before the covering process. This preliminary preparation ensures that air pressure can escape during assembly, preventing defects while maintaining the simplicity of a single-piece cover structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the reliability of electronic sensor packages by preventing air pressure-induced defects and maintaining a sealed structure, even in extreme environments, while using a single-piece cover without holes.
Implementation Method 1
discharge holes extending through specific leads and/or the die paddle to allow air pressure relief within the cavity formed by the cover
Data Source
AI summary
An electronic package structure includes a substrate having a plurality of conductive leads. A discharge hole is disposed to extend through the substrate. An electronic chip is electrically connected to the plurality of conductive leads. A case is connected to the substrate and defines a cavity between the substrate and an upper of the case. The discharge hole and the electronic chip are disposed within the cavity, and the discharge hole is open to the outside in the electronic package structure. The discharge hole is configured to discharge air pressure that forms during the assembly process thereby improving the reliability of the electronic package structure.