Lead Frame Shielding Structure for Thin EMI Semiconductor Packages
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Solution Overview
Problem
Current electromagnetic shielding methods for semiconductor packages involve thick electromagnetic shielding metal covers, which increase the package structure's thickness, hindering miniaturization and affecting performance.
Innovation Solution
A lead frame with integrated conductive wires are used to form a continuous conductive surface, spanning the chip and connected to opposing leads, forming a conductive surface that blocks electromagnetic interference, and a molding layer covers the conductive wire, spanning the chip and the molding layer, forming a continuous conductive surface that blocks electromagnetic interference, and a molding layer covers the conductive wires, providing electromagnetic shielding without increasing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a thick electromagnetic shielding metal cover is used to shield the package structure, then electromagnetic shielding performance is improved, but the package structure's thickness increases
Solution Approach 1:
The patent divides the electromagnetic shielding function into multiple thin conductive wire layers instead of using a single thick metal cover. The conductive wires are arranged in specific patterns (such as grid or mesh structures) to create multiple shielding planes that collectively provide effective electromagnetic shielding while maintaining thin overall thickness.
Solution Approach 2:
The patent employs thin conductive wire structures that function similarly to thin films or shells in providing electromagnetic shielding. These conductive wires are integrated into the package structure as thin layers, replacing the traditional thick metal cover and achieving shielding performance with minimal thickness addition.
2Object-affected harmful factors
If a thick electromagnetic shielding metal cover is used, then electromagnetic shielding performance is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges the electromagnetic shielding function with the existing package structure by integrating conductive wires into the molding compound or lead frame assembly. This combination eliminates the need for separate shielding components and their associated mounting processes, thereby simplifying the overall manufacturing workflow while maintaining shielding effectiveness.
Solution Approach 2:
The conductive wire structure serves multiple functions: it provides electromagnetic shielding, acts as part of the electrical interconnection system, and integrates with the mechanical structure of the package. This multi-functionality reduces the number of separate components and assembly steps required, thereby simplifying manufacturing.
3Object-affected harmful factors
If a thick electromagnetic shielding metal cover is used, then electromagnetic shielding performance is improved, but the package volume increases
Solution Approach 1:
The patent transitions from a three-dimensional thick metal cover to a two-dimensional or quasi-two-dimensional conductive wire pattern embedded within the package structure. By arranging conductive wires in planar patterns (such as grids or meshes) within the molding compound, the shielding function is achieved with minimal impact on the package's overall volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method reduces the package structure's thickness while effectively shielding against electromagnetic interference, enhancing performance and reliability, and simplifying manufacturing processes.
Implementation Method 1
forming a conductive surface that blocks electromagnetic interference
Data Source
AI summary
A package structure includes a lead frame including a first surface, wherein the lead frame includes a base and first leads located on its four sides, a first chip provided on a first surface of the base, and a first conductive wire located on a first surface of the lead frame and spanning the first chip. Two ends of the first conductive wire are electrically connected with the first leads on opposing two sides of the base.