Lead Frame Package With Exposed Conductive Flags
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Solution Overview
Problem
Existing semiconductor packages require significant space on circuit boards due to the internal location of conductive components, which increases the footprint and manufacturing complexity.
Innovation Solution
A lead frame package design with exposed, conductive flags integral to the lead fingers, allowing for external mounting of components and reducing the need for intervening materials, achieved through a stamping process that forms continuous conductive surfaces and flags without additional connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductive components are placed internally within the package, then electrical connections are established, but the package footprint increases and manufacturing complexity increases
Solution Approach 1:
The patent moves conductive components from internal horizontal placement to external vertical placement. The flags extend outward from the lead frame body in a vertical dimension, allowing components to be mounted on the exterior surface rather than requiring internal horizontal space. This dimensional transition reduces the horizontal footprint while maintaining electrical connectivity functions.
Solution Approach 2:
The patent extracts the conductive components (flags) from the internal structure and positions them on the external surface of the package. By taking out the conductive elements from the enclosed internal space and placing them on the exterior, the design eliminates the need for complex internal routing and reduces overall package complexity.
2Reliability
If intermediate materials and connections are used to connect components, then electrical connections are established, but the circuit robustness and integrity are reduced
Solution Approach 1:
The patent merges the flag structure with the lead frame body into a single integrated component. The flags are formed as continuous extensions of the lead frame material, eliminating the need for separate intermediate connection elements. This merging reduces the number of discrete components and interfaces, thereby improving circuit robustness and reducing overall device complexity.
Solution Approach 2:
The lead frame structure serves multiple functions simultaneously: it provides mechanical support, electrical connectivity, and component mounting surfaces. The flags self-integrate with the lead frame body, creating a self-sufficient structure that eliminates the need for additional intermediate materials or connection elements.
3Area of stationary object
If components are mounted internally within the package, then space on circuit board is consumed, but vertical clearance is not utilized
Solution Approach 1:
The patent transitions from horizontal internal mounting to vertical external mounting. By extending flags vertically from the lead frame body and mounting components on these external flags, the design utilizes the vertical dimension above the package. This allows components to be positioned in the vertical clearance space rather than consuming horizontal circuit board area.
Data Source
AI summary
Disclosed is a device including a first finger of a plurality of lead fingers of a lead frame connected to a first flag. A second finger of the plurality of lead fingers of the lead frame is connected to a second flag. A semiconductor die is coupled to the lead frame. An encapsulant covers the semiconductor die, the lead frame, and a first end of the plurality of lead fingers, and excludes the first flag and the second flag. The first flag and the second flag are separated and electrically isolated from one another by the encapsulant.