Lead-Frame Fan-Out Package Structure for Dense Wiring and Heat Dissipation
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Solution Overview
Problem
Current chip package structures face challenges in combining high-density wiring with effective heat dissipation and reliability, as fan-out packages are low in reliability and heat dissipation, while lead-frame packages struggle with high-density wiring.
Innovation Solution
A package structure that includes electrical elements, a first and second reconstruction layer, and a metal lead frame, where the second reconstruction layer has a smaller pin pitch than the metal lead frame, and a method involving forming a first plastic package layer, a second reconstruction layer, and a metal lead frame with a heat dissipation layer to enhance thermal management and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fan-out package is used for high-density wiring, then wiring density is improved, but reliability and heat dissipation deteriorate
Solution Approach 1:
The invention divides the package structure into distinct functional layers: a lead frame substrate providing mechanical support and thermal management, and a separate fan-out wiring layer providing high-density electrical interconnections. This segmentation allows each layer to optimize its specific function without compromising the other, resolving the contradiction between wiring density and reliability.
Solution Approach 2:
The invention introduces an intermediary structure (the lead frame with embedded wiring) that mediates between the high-density fan-out wiring layer and the substrate. This intermediary provides both mechanical support and thermal pathways, enabling the fan-out layer to achieve high wiring density while maintaining package reliability through the lead frame's structural and thermal properties.
2Productivity
If fan-out package is used for high-density wiring, then wiring density is improved, but heat dissipation capacity deteriorates
Solution Approach 1:
The package structure segments thermal management functions from the wiring functions. The lead frame substrate is dedicated to providing thermal pathways and mechanical support, while the fan-out wiring layer handles electrical interconnections. This allows heat dissipation to be optimized independently of wiring density requirements.
Solution Approach 2:
The lead frame serves multiple functions simultaneously: it provides mechanical support for the package, establishes thermal pathways for heat dissipation, and enables electrical interconnections. This multi-functionality allows the structure to support high-density wiring while maintaining effective heat dissipation capabilities.
3Reliability
If lead-frame package is used for low cost and high reliability, then cost and reliability are improved, but wiring density deteriorates
Solution Approach 1:
The invention transitions from planar wiring on the lead frame surface to three-dimensional wiring by embedding conductive structures within the lead frame and adding multiple wiring layers. This dimensional change enables high wiring density while maintaining the lead frame's inherent reliability and cost advantages.
Solution Approach 2:
The invention implements a nested structure where fan-out wiring layers are embedded within and around the lead frame structure. The lead frame provides the foundational framework, while additional wiring layers are nested within the package structure, achieving high wiring density without compromising the lead frame's reliability and cost-effectiveness.
Data Source
AI summary
The present invention provides a package structure and a method for manufacturing the same. The package structure includes at least two electrical elements, a second reconstruction layer, and a metal lead frame, wherein at least one of the electrical elements is a chip, at least one of the electrical elements has a first reconstruction layer, and the second reconstruction layer has a smaller pin pitch than that of the metal lead frame; the second reconstruction layer has a first surface and a second surface, a functional surface of the electrical element is disposed on and connected to the first surface, and at least one of the electrical elements is connected to the second reconstruction layer; and the second surface is disposed on and connected to the metal lead frame. A fan-out package structure is formed on the metal lead frame, which improves the heat dissipation capacity of the chip.